Industry News

SUSS Bonds with MEMS Research Lab in Mexico

The University of Juarez (UACJ), Mexico, has selected SUSS MicroTec ’s advanced wafer bonding equipment for its research laboratory. UACJ is an integral member of the Paso del Norte (PDN) Regional MEMS Cluster and a key player in supporting bi-national innovation and entrepreneurial development in Mexico. The cluster consists...
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3GSM 2007 Gets the Party Started

On Monday (12 February) the 2007 3GSM World Congress commenced and by the time the doors close on the world’s premier mobile event on Thursday (15 February) it is expected that over 60,000 visitors will have frequented the Fira de Barcelona Conference and Exhibition Center. Socially the event got...
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Agilent To Expand Investment In Device Modeling

Agilent Technologies Inc. announced plans to expand the company's investment in its Integrated Circuit Characterization and Analysis Program (IC-CAP) device modeling software. The company will establish a new research and development modeling center in Asia to better serve the industry's leading semiconductor foundries and to respond to advancements in...
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Comtech Receives $9.5 M For MTS Contract

Comtech Telecommunications Corp. announced that its Maryland-based subsidiary, Comtech Mobile Datacom Corp., received orders totaling $9.5 M on its Movement Tracking System, or MTS contract, with the U.S. Army. The total includes $8.9 M of MTS program orders and $0.6 M in follow-on orders for the Army National Guard's...
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Thales Uses EMC Simulation To Reduce Testing Costs

Thales Technical Unit Control and Display Systems (CDS) uses electromagnetic compatibility (EMC) simulation to reduce testing costs on each new cockpit instrument. EMC is a major design challenge in cockpit instruments because they have a clear face which makes them difficult to shield. FLO/EMC electromagnetic simulation software from Flomerics...
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Silicon Labs Reaches Agreement With NXP

Silicon Laboratories Inc. , a leader in high performance, analog-intensive, mixed-signal integrated circuits (IC), announced a definitive agreement with NXP , formerly Philips Semiconductor. NXP will purchase the Aero transceiver, AeroFONE™ single-chip phone and power amplifier product lines, for $285 M in cash, with additional earn-out potential of up...
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Anaren Lands Contract in Excess of $8 M

Anaren Inc. has been selected to receive a contract valued in excess of $8 M from Alcatel-Alenia Space (France) for development and production of integrated beamforming assemblies that will be deployed on the Globalstar-2 satellite payload. The contract award, expected to be finalized within 90 days, covers design services...
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Ask Harlan: Question of the Month - February 2007

Published February 7, 2007 In an effort to better combine the editorial content of our magazine with our newly developed and retooled on-line presence, we have decided to expand Harlan's RF and microwave engineering advice into a monthly feature that appears in Microwave Journal. Harlan has selected one question...
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Provigent Moves to Larger Offices

Provigent , a provider of system-on-a-chip (SoC) solutions for the broadband wireless transmission market, has moved its offices from Los Altos to Santa Clara, CA. “This move reflects the accelerated pace at which the market is adopting Provigent’s point-to-point system-on-a-chip (SoC) solutions,” stated Guy Nathanzon, Provigent’s CFO. “Provigent’s growing...
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