StratEdge Introduces High-frequency Surface-mount Package
StratEdge, a leader in the design and production of semiconductor packages for microwave, millimeter-wave and high speed digital devices, announces the release of its new high-frequency SMX Series surface-mount package. The new DC to 30 GHz package is designed for use in test and measurement, VSAT, point-to-point, point-to-multipoint, WiMAX, and other applications where a high-frequency, surface-mount package is desired.
This new addition to the SMX Series is designed to provide good electrical transition performance for die up through the Ka-band frequency range. Transition loss is expected to be less than 0.5 dB for frequencies up to 30 GHz. The packages are made to provide wideband electrical performance and they incorporate copper composite bases for enhanced thermal dissipation. These are true surface-mount packages that allow automated assembly and soldering for high volume production of devices without sacrificing electrical and thermal performance. They are sealed with cup-shaped liquid crystal polymer lids with B-stage epoxy preforms or can be provided in conventionally hermetic configurations for military and aerospace applications.
The high-frequency SMX package, part number 580495, is a 10-lead design with 6 RF and 4 DC pins. The package incorporates a copper-composite base and Fe-Ni-Co leadframe attached to an alumina ceramic ring frame. The package base is 0.278 x 0.315 inch and the cavity is 0.220 x 0.205 inch. The 580495 will be offered as a standard design, with samples and volume production quantities available in Q3 2009.
“This is a revolutionary breakthrough for high-frequency applications,” said StratEdge President and CEO Tim Going. “Our new SMX package is the first of its kind – a completely hermetic, surface-mount solution for 30 GHz applications. We have many customers who have been waiting a long time for this type of packaging solution.”
The new 580495 package is available as part of StratEdge’s SMX family of products. The SMX Series features surface-mount packages in various sizes and lead counts. With leads and base co-planar, SMX packages are designed for mounting directly on the circuit board, greatly reducing circuit board assembly costs. Surface-mount packages also simplify the board layout and can significantly reduce board design costs.