Microwave Journal

Mercury’s Commercial Technology Leverages Investment in U.S. Microelectronics

March 24, 2022

Mercury Systems, Inc announced the new RFS1140 system-in-package (SiP), a first to combine powerful state-of-the-art FPGA processing with Jariet Technologies’ high speed data converters at chip scale and manufactured in a trusted U.S. microelectronics facility. By delivering the latest commercially developed integrated circuits, Mercury’s SiP devices revolutionize edge processing applications by maximizing performance in a trusted, highly customizable architecture.

Most Si for defense applications is designed by domestic chipmakers but fabricated in overseas foundries representing a vulnerability in the microelectronics supply chain. The RFS1140 is manufactured in Mercury’s trusted defense microelectronics activity (DMEA)-accredited microelectronics facility in Phoenix, Ariz., an example of how Mercury is making commercial technology profoundly more accessible to the DOD.

“In the fall of 2019 Mercury announced a $15 million strategic investment in trusted microelectronics technology innovation,” said Tom Smelker, vice president, Mercury Systems. “Our new RFS1140 is our latest product supporting that investment. By combining high speed data converters, digital processing, memory and power in a single package, Mercury lowers overall system costs and complexity, and enables placement closer to the sensor edge, reducing latency. In addition, our trusted onshore design, manufacturing and testing directly support DOD requirements for critical state-of-the-art microelectronics.”

A trusted, secure, low-latency solution that reduces back-end processing

  • Best-in-class Si technology for a dramatic increase of performance per unit area
  • State-of-the-art FPGA processing, high speed data converters with four channels
  • Integrated power and memory
  • High speed direct digitization up to 64 GSPS at the sensor edge.

Onshore trusted manufacturing in a DMEA-accredited facility.