Microwave Journal
www.microwavejournal.com/articles/37127-thermal-and-stress-analysis-of-3d-ics-with-celsius-thermal-solver
3D-ICs integrate many dies that are densely packed, which leads to heat generation that causes performance issues. This white paper helps designers understand the cross-fabric thermal challenges introduced by 3D-ICs and explains how the CadenceĀ® Celsiusā„¢ Thermal Solver helps designers analyze and develop strategies to mitigate this impact.

Thermal and Stress Analysis of 3D-ICs with Celsius Thermal Solver

November 15, 2021

3D-ICs integrate many dies that are densely packed, which leads to heat generation that causes performance issues. This white paper helps designers understand the cross-fabric thermal challenges introduced by 3D-ICs and explains how the Cadence® Celsius™ Thermal Solver helps designers analyze and develop strategies to mitigate this impact.

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