MixComm Announces Breakthrough 39 GHz “SUMMIT 3741™” 5G Front-End IC
MixComm’s latest device, built on GLOBALFOUNDRIES enhanced 45RFSOI, delivers industry leading combination of output power, energy efficiency and integration
MixComm announced the latest addition to its portfolio of breakthrough front-end ICs for 5G mmWave. The SUMMIT 3741 integrates novel power amplifiers (PAs), low noise amplifiers, T/R switching, beamformers, calibration, gain control, beam table memory, temperature and power telemetry and high speed SPI control for a front-end module with optimal partitioning for 5G infrastructure. The device is suitable for antenna-in-package implementations, as well as conventional chip-on-board integration through the use of interposers. SUMMIT 3741 also features enhanced and cutting-edge digital integration, uniquely enabled by the GLOBALFOUNDRIES® (GF) 45RFSOI process, which has inherent advantages over other semiconductor technologies for mmWave applications.
MixComm SUMMIT 3741 product highlights:
• Operation from 37 to 41 GHz
• Four-element dual-polarization TX/RX
• Independent dual-polarization beam directions
• Ultra-low TX- and RX-mode power consumption
• High-power, high efficiency stacked SOI CMOS PAs
• Low-loss T/R switch for TDD support
• 6-bit full-360-degree phase shifting and 0.5 dB-step 16 dB-range variable gain in each path
• Fully calibrated for gain/phase matching Across ICs
• On-chip temperature sensor
• Gain control for temperature compensation
• On-chip power sensor for each TX
• Operates from 1 V, 1.8 V and 4 V power supplies
• 100 MHz SPI with 2048-entry on-chip beam table storage
• 6-/8-bit chip ID with multiple modes of programming
• Flip-chip die with 75 μm bump size and 200 μm bump pitch
“5G will continue to push towards the higher mmWave frequency bands, bringing new challenges to conventional approaches,” said Dr. Harish Krishnaswamy, MixComm co-founder and CTO, adding, “With SUMMIT 3741, we are introducing several ‘firsts’ to the market and look forward to working with our customers to push the envelope for 5G mmWave.”
Like the SUMMIT 2629, which has been shipping to customers since 4Q 2020, the SUMMIT 3741 has been designed to address the critical challenges that currently constrain 5G mmWave success, by:
- Extending range to decrease carrier cost and improve customer satisfaction
- Reducing thermal and electrical power consumption budgets
- Optimizing antenna arrays to reduce module cost.
These benefits make the MixComm solutions ideal for 5G infrastructure ranging from gNodeB base stations and repeaters to customer premise equipment. The flexible architecture and ultra-low power operation will also enable 5G hotspots and other user equipment demanding long battery life and sleek form factors.
The SUMMIT 3741 will be available for sample in early Q3, 2021. MixComm will showcase the Summit 3741 and its other products and technology at the upcoming International Microwave Symposium (IMS2021) being held in Atlanta, Ga., June 8-9. MixComm will exhibit in booths 1028 and 1221.