Microwave Journal
www.microwavejournal.com/articles/35487-edi-con-across-china-launches-in-2021
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EDI CON Across China Launches in 2021

February 22, 2021

In response to the continuing challenges caused by the global pandemic, the organizers of EDI CON CHINA have decided to change the program for 2021 to ensure timely delivery of technical conference material to engineers across the country. Today, Horizon House announced that instead of a large in-person event this year, EDI CON CHINA 2021 will occur as EDI CON ACROSS CHINA 2021, which will include a virtual event paired with localized in-person conferences throughout China. EDI CON CHINA will return to its regular format, with a full in-person conference and exhibition, in Beijing at the CNCC 26-27 April 2022 for its hallmark event.

The EDI CON ACROSS CHINA virtual conference, will take place 12-13 May with two days of online sessions, workshops, and keynotes from international speakers covering topics on 5G, WiFi, IoT, satellite, radar, and automotive. Then, EDI CON ACROSS CHINA will launch a series of in-person localized conferences with stops in Shanghai (22-23 July) and Shenzhen (9-10 December), with planned tracks on semiconductor applications and design, 5G and Radar/Automotive. The Shanghai and Shenzhen events will also include an exhibition with tabletop displays.

“EDI CON CHINA traditionally occurs in Beijing in the spring but had to delay until the fall of 2020 due to the pandemic. This transitional program for 2021 allows us to provide technical content to our loyal audience during 2021 and enables us to set up a successful return to our regular time frame and location in Beijing in April 2022,” said Ivar Bazzy, president of Horizon House. 

More information regarding this new program and plans for 2022 will be released and available at http://www.ediconchina21.com/.