Microwave Journal
www.microwavejournal.com/articles/34910-qorvo-wins-us-government-project-to-create-advanced-state-of-the-art-rf-semiconductor-packaging-center
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Qorvo Wins U.S. Government Project to Create Advanced, State-of-the-Art, RF Semiconductor Packaging Center

November 5, 2020

Qorvo® has been selected by the U.S. government to create a state-of-the-art heterogeneous integrated packaging (SHIP) production and prototyping center for RF assemblies, a program valued at up to $75 million.

The goal of the SHIP program is to ensure that microelectronics packaging expertise and leadership is available for both U.S. defense contractors and commercial clients requiring design, validation, assembly, test and manufacturing of next-generation RF components. Qorvo’s role is to design and deliver the highest levels of heterogeneous packaging integration, which is essential to meet the size, weight, power and cost requirements for next-generation phased array radar systems, unmanned vehicles, electronic warfare platforms and satellite communications.

James Klein, president of Qorvo’s infrastructure and sefense segment, said, “This award reflects Qorvo’s proven track record as a global leader in RF technology with over 35 years of experience. As part of this collaboration, Qorvo will expand its proven capabilities in Texas to create a SOTA facility that best serves the needs of the U.S. government and commercial customers.”

Qorvo’s U.S.-based capabilities include advanced manufacturing, packaging and testing for both high and low power applications from DC to 100 GHz. Qorvo holds a Defense Microelectronics Activity Category 1A trusted source certification for package assembly, test and wafer foundry services at its Richardson, Texas, location.

Qorvo offers defense customers the scale from applying its high yield manufacturing capabilities serving commercial markets, where it supplies more than four billion heterogeneous modules annually.

The SHIP other transaction agreement (OTA), which is exclusive to Qorvo, was awarded by the Crane Division of the Naval Surface Warfare Center (NSWC). The program is funded by the Office of the Undersecretary of Defense for Research and Engineering’s Trusted and Assured Microelectronics Program and administered by the Strategic & Spectrum Missions Advanced Resilient Trusted System OTA, in turn managed by the National Security Technology Accelerator.