Microwave Journal
www.microwavejournal.com/articles/33780-ctx-high-frequency-wire-bondable-chip-termination-series
CTX Series (003)

CTX High Frequency Wire Bondable Chip Termination Series

April 10, 2020

Smiths Interconnect, a leading provider of technically differentiated electronic components, subsystems, microwave and radio frequency products announced today the release of its new CTX high frequency wire bondable chip termination series optimized to combine high frequency and power in a small package.

The new CTX Series is designed to offer excellent broadband performance up to 64GHz. It allows wider coverage than traditional components while providing optimized return loss for multiple band ranges and applications.  This allows the customer to use a single chip in multiple applications reducing the cost of ownership.

“Higher frequency, reduced footprint, increased power rating and the capability to produce in high volumes makes our new terminations a unique offering in the marketplace, suitable for SATCOM applications, 5G broadband requirements and Defence systems”, says Paul Harris, VP of Sales and Marketing.

With the CTX Series Smiths Interconnect utilises 60 years of experience in the Space and Defence markets to provide a cost-effective solution to the demand of high frequency chip termination products specifically tuned to operate from L through V band frequency ranges. The power levels vary depending on the band of interest and are able to support multiple applications.

   The new CTX series is a compact unique solution covering multiple applications in a system reducing the bill of material and offering:

  • Power rating up to 5 Watts, increased by up to 5x over alternative solutions
  • Frequency rating DC to 64 GHz with optimal broad band performance
  • Reduced footprint (up to 75% smaller) allowing for space and weight savings on the board: 0.040” x 0.040” x 0.015” (1.016mm X 1.016mm x 0.381 mm)
  • High volume production capability supporting customers’ quick ramp up program needs

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