Microwave Journal
edi con china

EDI CON CHINA Rescheduled to September 2020

February 28, 2020

Following the developments of the coronavirus (COVID-19) outbreak closely and its impact on colleagues and customers in China, Horizon House announced today that EDI CON CHINA, May 12-13, 2020 in Beijing, China has been rescheduled for September 27 and 28, 2020 at the Chinese National Convention Center (CNCC), Beijing, China.

“We express our sincere thanks to our exhibitors, sponsors and media partners for their ongoing support of EDI CON CHINA, and we send our very best wishes to our colleagues, friends and customers who are directly affected by the COVID-19 virus,” said President of Horizon House, Ivar Bazzy, “We thank everyone for their patience as we shift to a new date for our 2020 event in the fall in Beijing.”

EDI CON CHINA brings together speakers, exhibitors and engineers who are focused on high-frequency analog and high-speed digital designs. The event includes a robust expo floor filled with industry leading vendors as well as workshops, panels, forums and a peer-reviewed conference program that aim to increase knowledge of engineering techniques, methodologies and technical concepts.

Major sponsors include Host Sponsor Keysight Technologies and Diamond Sponsor Rohde & Schwarz. Gold sponsors include Xiamen San'an Integrated Circuit Co., Ltd., WIN Semiconductors Corporation, Sichuan YiFeng Electronic Science & Technology Co., Ltd, Richardson RFPD and Mini-Circuits.

More information, including an application to exhibit or to participate in the SOI Forum, is available at www.ediconchina.com. Register now to attend at https://www.ediconchina.com/register-now/.