One Component, No Mix, Die Attach Epoxy: EP17HTS-DA
Master Bond EP17HTS-DA is a new one component, no mix, die attach epoxy that is electrically conductive and withstands high temperatures. It is a silver filled system. Typically, glass transition temperature (Tg) declines with the addition of a filler like silver. However, with this specialty formulation, a high Tg of 140-150°C is maintained and it passes MIL-STD-883J thermal stability requirements at 200°C.
Its strength profile is also notably robust with a die shear strength of 35-40 kg-f at room temperature. EP17HTS-DA meets NASA low outgassing specifications and its service temperature extends from -80°F to 550°F. It has a low volume resistivity of less than 0.005 ohm-cm and also performs well as a heat conductor.
EP17HTS-DA is a thixotropic paste and can be easily dispensed manually or via automated dispensing systems. This compound is not premixed and frozen and has an unlimited working life at room temperature. It requires a heat cure of 300°F for 2 to 3 hours, followed by post curing at 350°F for 1 to 2 hours.
This product bonds well to many substrates including metals, ceramics and plastics. It is recommended for applications where low volume resistivity and high temperature resistance is required. EP17HTS-DA is available for use in syringes and glass jars, in sizes ranging from 20 grams to several pounds.