IEEE 2019 HIR Identifies Long-Term Tech Requirements to Inspire Collaboration in Electronics
The IEEE has published the 2019 edition of the Heterogeneous Integration Roadmap (HIR), discussing technology requirements and potential solutions for the future of electronics. The HIR is intended to accelerate technology and industry progress through pre-competitive collaboration among industry, academia and government.
The roadmap, which can be downloaded here, provides a comprehensive and strategic forecast of technology over 15 years, with a 25-year R&D outlook for heterogeneous integration of emerging devices and materials. It is sponsored by the IEEE Electronics Packaging Society, SEMI, the IEEE Electron Devices Society, the IEEE Photonics Society and The American Society of Mechanical Engineers.
The electronics industry relies on the integration of separately manufactured components into higher-level assemblies to enable enhanced functionality and operation. This heterogeneous integration of wireless and mixed-signal devices, bio-chips, power devices, optoelectronics and microelectromechanical systems in a single package places new requirements on the electronics industry as these diverse components are introduced into system-in-package (SiP) architectures for the many applications and industries using electronics.
“The HIR, with its broad input from industry and academia, represents an invaluable resource that sets the course for continued electronics industry growth, greater technology innovation and enhanced performance of devices across a wide variety of applications that can bring increased benefits to humanity.” — William Chen, chair of the HIR and ASE Fellow
“Today’s innovators, as well as future technologists, are encouraged to leverage the extensive, informative guidance contained within the HIR and actively participate in its future evolution.” — Ravi Mahajan, Intel Fellow, High Density Interconnect Pathfinding, Intel Corporation, and IEEE, ASME Fellow
"The broad industry support for the HIR is a clear mandate for us to stay ahead of the innovation curve and identify barriers that could slow the pace of growth in the electronics industry.” — Ajit Manocha, president and CEO of SEMI