Airstrip(TM) — an Innovative Transmission Line Technology in Support of Hi-Rel Space Qualified Packaging
Mechanical integration of microwave components often becomes the last step while addressing manufacturing considerations for system-level designs. In many cases, the electrical design is analyzed, boards built, designs reverified, then mechanical engineers fit everything into the final package. This paper shows how component manufacturers can help solve system-level packaging problems using Airstrip technology.
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