Microwave Journal

Taconic’s Advanced Dielectric Division to Attend 2018 HKPCA & IPC Show

November 29, 2018

From December 5-7, 2018 Taconic’s Advanced Dielectric Division will be exhibiting at this year’s International Printed Circuit & Electronics Assembly Fair (2018 HKPCA & IPC Show) located at the Shenzhen Convention & Exhibition Center in China.

Last year, the HKPCA & IPC Show hosted over 540 exhibitors and 44,026 visitors from 17 countries/regions. Almost 2600 booths were present filling the 52,500 sqm exhibiting area.

Why Visit Taconic at Booth 6G21/6G22?

Founded in 1984, Taconic's Advanced Dielectric Division set a goal to manufacture and supply the highest quality microwave circuit board materials available on the market. Now, over thirty three years later, the ISO 9001 registered company has developed into a world leader in the manufacture of RF laminates, prepregs and high speed digital/flexible interconnect materials.

Simultaneously, Taconic has solidified its worldwide presence through the introduction of manufacturing facilities in the U.S., Canada, Ireland, Korea, the U.K., France, Poland and Brazil as well as sales offices around the globe.

This year, Taconic will be highlighting the following products:

  • NF-30 (for 77 GHz ADAS)
  • RF-35TC-A (Thermally conductive TC ~ 1 W/mK for Power Amplifier and Base Station Antennas
  • RF-30A (For Base Station Antennas)
  • TSM-DS3 and fast Rise-time prepreg for 5G multilayer