Microwave Journal
www.microwavejournal.com/articles/31085-qorvo-introduces-iot-sip-to-improve-smart-home-solutions

Qorvo® Introduces IoT SiP to Improve Smart Home Solutions

September 24, 2018

Qorvo® introduced a new System in Package (SiP) that enables dynamic, simultaneous support for Zigbee® 3.0, Green Power, Thread and Bluetooth Low Energy (BLE). This new SiP integrates Qorvo power amplifier technology providing 20 dBm output, which is especially important for U.S. smart home applications.

The Qorvo QPG6095M is a fully integrated SiP for ultra-low power wireless communications. It is BLE 5.0 and Zigbee 3.0 platform and product certified, and offers Green Power energy efficiency. This SiP also extends range and battery life, and enables robust interference mitigation. The QPG6095M delivers optimized connectivity throughout the home, eliminating the need for complex mesh architectures and unnecessary battery consumption in intermediate devices.

The QPG6095M blends Qorvo’s power amplifier (PA) technology with a multi-standard, multi-protocol chip. Its level of integration and performance benefit product designers by lowering development costs and speeding time to market.

Cees Links, general manager of Qorvo’s Wireless Connectivity business unit, said, “This new SiP is another example of Qorvo’s commitment to combining and leveraging RF technologies to improve the consumer’s connected experience. Developers can now deliver BLE, Zigbee and Thread simultaneously with more range and reliability, and reduce concerns about future compatibility.”

Qorvo’s Wireless Connectivity business is a leading developer of wireless semiconductor system solutions for connected devices and Wi-Fi integrated front-end solutions. Qorvo offers a broad range of advanced RF chips and software for smart home data communications and the IoT.