Microwave Journal
www.microwavejournal.com/articles/30356-richardson-rfpd-introduces-new-board-level-shields-from-te-connectivity
TE Conn

Richardson RFPD Introduces New Board Level Shields from TE Connectivity

May 17, 2018

Richardson RFPD announced the availability and full design support for a new portfolio of board level shields from TE Connectivity. These new board level shields are stamped one- and two-piece metal cages that help provide isolation of board-level components, minimize crosstalk and reduce EMI susceptibility without impacting system speed.

The new standard BLS portfolio is available in industry-standard cold rolled steel (CRS), as well as aluminum material for weight savings and improved thermal conductivity. The standard devices are available as one-piece and two-piece solutions in a variety of shapes (rectangle, pentagon, L-shape) that enable rapid prototyping.

TE also offers a wide array of customized BLS solutions.

The new devices are suitable for any application that needs board-level EMI suppression, including mobile phones and tablets, game consoles, commercial and enterprise routers, point-of-sale equipment, wireless meters, wireless speakers, wearables, IoT, drones, virtual reality headsets, femtocells and servers.

Additional key features of the standard one- and two-piece board level shields include:

  • 2-piece solutions minimum height: 0.90 mm
  • 1-piece solutions minimum height: 0.50 mm
  • Common materials and thicknesses
  • Use of common, proven design features