Microwave Journal
www.microwavejournal.com/articles/29615-qualcomm-announces-rffe-design-wins-with-google-htc-lg-samsung-sony-mobile

Qualcomm Announces RFFE Design Wins with Google, HTC, LG, Samsung, Sony Mobile

January 11, 2018

Qualcomm Technologies Inc., a subsidiary of Qualcomm Inc., announced radio frequency front-end (RFFE) design wins with a host of leading original equipment manufacturers (OEM), including Google, HTC, LG, Samsung and Sony Mobile. Qualcomm Technologies’ portfolio of RFFE platform solutions is designed to help OEMs deliver advanced mobile devices at scale and with accelerated time to commercialization. Qualcomm Technologies is the first technology provider to produce the hardware and software needed to deliver a comprehensive modem-to-antenna system solution to OEMs, which includes the new QPM26xx series of GaAs-based power amplifier modules including duplexers (PAMiDs), envelope trackers, antenna tuners, antenna switches and discrete and integrated filter modules.

RFFE is critical to the mobile experiences end-users expect from their devices and for enhancing future advancements across the mobile industry. Complementing its leading modem technology for next generation mobile devices, Qualcomm Technologies RFFE portfolio delivers mobile RF solutions that support new technologies such as Gigabit LTE, 4 x 4 MIMO, LTE Advanced and the commercialization of 5G technologies in 2019.

Qualcomm's RFFE design pipeline reflects recent steps in the company’s business strategy to develop and commercialize comprehensive mobile solutions, from the digital modem to the antenna. Following the February 2017 completion of the RF360 Holdings Singapore PTE. Ltd., joint venture between Qualcomm Incorporated and TDK Corporation, Qualcomm Technologies introduced a suite of comprehensive RFFE products that added new and significant capabilities to its portfolio. These included its

  • first GaAs power amplifier modules,
  • next-generation Qualcomm® TruSignal™ antenna tuning solution,
  • premium-tier PAMiD modules,
  • 600 MHz band (B71) support with a low-band PAMiD module, GaAs multi-mode power amplifier (MMPA) products and a B71-optimized aperture tuner,
  • temperature-compensated (TC) surface acoustic wave (SAW) diversity receiver filter and duplexer,

Additionally, at a November 2017 groundbreaking event in Singapore, RF360 Holdings conducted a signing ceremony to expand production capacity at its key manufacturing production site dedicated to manufacturing RFFE SAW wafers, as well as thin-film acoustic packaging.

Cristiano Amon, president of Qualcomm Inc., said, “Only Qualcomm Technologies is delivering robust end-to-end RFFE and modem solutions tailored for each tier of devices to address the increasingly complex RF demands of current networks in Gigabit LTE and beyond. This is proven out by our extremely strong design pipeline for RF front-end. Our advanced RF solutions deliver superior connectivity performance and flexibility in form factor design, and we’re thrilled to work alongside customers like Google, HTC, LG, Samsung and Sony Mobile to help deliver this combination of form and function to consumers around the world.”