Microwave Journal

New Products - Processing Equipment

February 1, 2000

Processing Equipment

Hot Bar Bonder System
The model 2000 pulsed-heat, hot bar bonder system combines a state-of-the-art controller, a wide selection of ceramic hot bar thermodes, precision part positioning/alignment mechanisms, a high accuracy Z-axis hot bar actuator and a microprocessor controlled user interface. Most suited for high throughput hot bar applications, the bonder system integrates into one system the critical features and functions needed for soldering, heat seal or ACF bonding. The system’s TC 1200 temperature controller provides power for rapid heating and precise closed-loop control to minimize overshoot and maintain fast, sustained cycle times.
MicroJoin Inc., a subsidiary of Palomar Technologies Inc., Poway, CA (858) 877-2100.

Light Calibration System
The models 2460-IV and 2460-V ball bonders are now available in two options: a two-axis programmable light-emitting diode (LED)-based lighting system and light calibration software. The LED system lights component surfaces with ultra-bright red LEDs for the vision processor to locate and reference bond sites. The light calibration software enables customers to calibrate programmable lighting systems to produce similar brightness levels across different machines with varying lamp and LED intensities and other manufacturing and aging variables. Applications for the 2460-V automatic wire bonder include high pin count devices, complex multichip modules and hybrid microcircuits, ceramic circuit boards, chip-on-board and chip-on-flex.
Palomar Technologies Inc., Vista, CA (760) 931-3600.