EDI CON USA 2017 Launches Scholarship Program
Open to any student interested in high frequency or high-speed electronics
EDI CON USA 2017, an event that brings together engineers working on high-frequency analog and high-speed digital designs, announces a new scholarship program for university students interested in high frequency or high-speed electronics. Any student that attends EDI CON USA 2017 can enter the drawing for a one of two $500 scholarships being given away by visiting the booths of three major sponsors in the exhibition Sept 12-13. The Gold level or higher sponsors include Analog Devices, Rohde & Schwarz, National Instruments, Anritsu and RF Lambda. All students will get free admission to the event using a special promo code and can attend conference sessions, workshops and the industry exhibition. Students can learn from the conference and workshops, ask questions to the various experts at the event, and visit companies in the industry to discuss products and career oppportunties.
EDI CON USA 2017 takes place at the Hynes Convention Center, September 11-13 in Boston, Mass. with session tracks covering RF/microwave, high-speed digital and EMC/EMI topics. The event will feature a 3-day conference, with extended tutorials and short courses on Monday, September 11, followed by technical sessions, invited talks, workshops, and panels on Tuesday and Wednesday. The technical sessions focus on actionable, educational information for working engineers rather than product pitches and commercial presentations.
EDI CON USA 2017 is supported by its primary media sponsors, Microwave Journal and Signal Integrity Journal. More information, including how to exhibit at EDI CON USA 2017, is available at http://www.ediconusa.com. For future planning, EDI CON USA 2018 will be held at the Santa Clara Convention Center (Santa Clara, CA) on October 17-18, 2018.