Microwave Journal
www.microwavejournal.com/articles/27741-edi-con-usa-announces-2017-conference-chairs

EDI CON USA Announces 2017 Conference Chairs

January 19, 2017

EDI CON USA 2017, an event that brings together engineers working on high-frequency analog and high-speed digital designs, will take place at the Hynes Convention Center, September 11-13 in Boston, Mass. The event management team is pleased to announce this year’s conference chairs: Thomas Cameron, CTO for the Communications Business Unit at Analog Devices Inc. will serve as the chair for the high-frequency subject areas, and Istvan Novak, senior principal engineer at Oracle, will serve as the chair for the high-speed digital areas of the conference.

“In our second year of EDI CON USA, we are dedicated to growing the success of the conference, reaching more attendees and providing the types of quality educational and networking opportunities that are crucial to today’s design successes,” said Janine Love, event director.

With more than 30 years of experience in R&D technology for telecom networks, Thomas Cameron currently serves as the CTO for the Communications Business Unit at Analog Devices, Inc., where he is guiding and contributing to the R&D of radio technology for 5G systems in both cellular and microwave frequency bands. His design experience includes cellular base stations, microwave radios and cable systems. Prior to joining Analog Devices in 2006, he contributed to the development of a broad range of RF systems and technologies over his career at Bell Northern Research, Nortel, Sirenza Microdevices and WJ Communications. He holds a Ph.D. in EE from the Georgia Institute of Technology.

An author, speaker, and engineer, Istvan Novak has been working with high-speed digital, RF, analog circuit, and system design for more than 30 years. His work has included the signal integrity design of high-speed serial and parallel buses (at SUN Microsystems), design and characterization of power-distribution networks and packages, and the development of test and measurement methods for power distribution validations. Currently senior principal engineer at Oracle, he has 25 patents and is a Fellow of IEEE for his contributions to signal integrity and RF measurement and simulation methodologies. He is the lead author of the book Frequency-Domain Characterization of Power Distribution Networks and tutor for industry courses on power and signal integrity at University of Oxford and CEI-Europe. He holds a Ph.D. from the Hungarian Academy of Sciences.

A unique aspect of EDI CON USA is that it brings together engineers working in RF/microwave with those working in high-speed digital. EDI CON USA offers an opportunity to learn from other disciplines and transfer techniques and methods between applications. The exhibit floor will include booths from industry-leading companies working in both of these areas, as well as feature the SI ZONE, a specialized demo area for signal integrity, power integrity, and EMI/EMC products. The exhibit hall will also feature the popular Frequency Matters Theater, which offers speed training, presentations, and lectures for all pass holders during the two exhibition days.

This year, EDI CON USA will feature a 3-day conference, with extended tutorials and short courses on Monday, September 11, followed by technical papers, workshops, and panels on Tuesday and Wednesday. The conference focuses on actionable, educational sessions rather than product pitches and commercial presentations. According to one conference attendee from EDI CON USA 2016, “It is wonderful to have so many specialists in one place. You can get your problems solved.” The technical sessions will be organized around tracks focused on RF, microwave, and high-speed digital design (including signal integrity, power integrity, and EMC/EMI), modeling and measurement topics.

This year, EDI CON USA is the only RF/microwave industry conference and exhibition in the continental USA, and the largest high-speed technical conference on the US East Coast. Networking opportunities will abound on the exhibit floor, and attendees can enjoy a welcome reception and happy hour. So, save the date, and make plans to attend and participate in the second annual EDI CON USA.

EDI CON USA 2017 is supported by its primary media sponsors, Microwave Journal and the Signal Integrity Journal.

More information, including how to exhibit for EDI CON USA 2017, is available at http://www.ediconusa.com. The Call for Abstracts is now open http://www.ediconusa.com/callforpapers.asp.  For future planning, EDI CON USA 2018 will be held at the Santa Clara Convention Center (Santa Clara, Calif.) on October 17-18, 2018.