Microwave Journal
www.microwavejournal.com/articles/27066-edi-con-usa-announces-expert-panel-sessions-on-5g-and-connected-cars

EDI CON USA announces expert panel sessions on 5G and connected cars

September 6, 2016

EDI CON USA 2016, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place September 20-22 in Boston, Mass. at the Hynes Convention Center, announces its interactive expert panel sessions covering 5G mmWave Applications and Connected Cars, moderated by Microwave Journal editors.

How will 5G Ride the mmWave?

Tuesday, September 20, 2016, 3:40 - 4:20 p.m., Room 208

This panel of experts from modeling, device and measurement companies will debate how to design, manufacture and test 5G mmWave components/systems today as trials are already underway well ahead of the 2020 standards development schedule. Although the standards are not determined, what mmWave technologies will likely be used first and how can we design devices and system that will meet these requirements today and verify their performance? See what the experts have to say and come with your questions about how to make 5G mmWave communications happen today.

Moderator: Pat Hindle, Editor, Microwave Journal

Panelists:

Michael Griffin, Planning Manager, WDO Wireless Devices and Operators, Keysight Technologies

Bill Kardine, Application Engineer, Rohde and Schwarz North America

Jin Bains, Vice President of R&D, National Instruments

Dr. Thomas Cameron, Chief Technology Officer, Communications Business Unit, Analog Devices

Robert Donahue, Chief Executive Officer, Anokiwave
Ken Karnofsky, Senior Strategist, Signal Processing and Communications, MathWorks

 

Not Your Father's Oldsmobile: The Connected Car

Wednesday, September 21, 2016; 2:40 - 3:20 p.m., Room 207

It used to be you bought a car because of the engine under the hood, the styling of the body, and the luxurious, heated leather seats. Now, the electronics technology in the car plays a significant role in your buying decision: integration with your smartphone, wireless connectivity, navigation and driving aids. This panel from the automotive supply chain will discuss how sensors, wireless links, and the cloud are improving the driving experience, from navigation to safety — even perhaps autonomous driving.

Moderator: Gary Lerude, Technical Editor, Microwave Journal. Panelists from Analog Devices,        Autoliv, NXP, and Rohde & Schwarz.

Registration is open for the event, which boasts a robust technical program for conference pass holders that includes a kick-off plenary as well as 60 technical sessions, 27 workshops and panels, 4 short courses, an all-day RF Back to Basics seminar, and 12 sponsored talks. On the exhibition floor, attendees holding any pass type can take advantage of three days of technical programming in the Frequency Matters Theater, as well as live demonstrations, a poster session, hands-on training, and demonstrations in the Signal Integrity Zone, in addition to the full show floor of exhibitors from the RF, microwave, and high-speed digital industries.

Focused on providing actionable information to practicing engineers, EDI CON USA offers multiple specialized conference tracks in order to appeal to engineers looking for in-depth technical information to help on the job today. These tracks include: RF/Microwave Design, Measurement, Modeling, Radar/Defense, Signal Integrity/Power Integrity, RF/Microwave Amplifiers, 5G/Advanced Communications, and Systems. Attending the conference sessions and short courses will require a 1-day or 3-day conference pass. All exhibition floor programming can be accessed using a free Expo pass. Conference registration is open now http://www.ediconusa.com/registration.asp.

About EDI CON USA

EDI CON USA uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON USA to find solutions, products, and design ideas that they can put into immediate practice for today's communication, defense, consumer electronics, aerospace, and medical industries.

Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, design contests, interactive sessions, speed trainings, networking opportunities, and educational talks that will address all aspects of design, simulation, test, and verification.

About the Organizers

EDI CON USA is organized by Microwave Journal and the event planning division of its parent company, Horizon House. Microwave Journal and Horizon House also team with Microwave Journal China and ACT International (Hong Kong) to organize and produce EDI CON China. An experienced and well-established organizer of targeted events, Horizon House additionally organizes European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA) and several major microwave related conferences/exhibitions such as the M2M and Mobile Backhaul Zones at CTIA Super Mobility. The EDI CON program is developed in collaboration with leading international technology companies and experts in high-frequency and high-speed electronic design with experience ranging from modeling and design to component characterization, system integration, and verification.

EVENT CONTACT:

Janine Love, Event Director

+1-857-350-2216

jlove@horizonhouse.com

Twitter: @tb_janine

 

SALES CONTACT:

Carl Sheffres, Publisher

+1-781-619-1949

csheffres@mwjournal.com

 

EDITORIAL CONTACTS:

North America:
Pat Hindle
+1 781 619 1946
PHindle@MWJournal.com
Twitter: @pathindle

 

International:
Richard Mumford
+44 207 596 8787
RMumford@MWJournal.com