Rogers Corp. to exhibit high-performance circuit materials at PCB West 2016 Conference & Exhibition
Rogers Corp. will bring its materials expertise to PCB West on September 14 at the Santa Clara Convention Center (Santa Clara, CA), booth 201. Rogers will exhibit its high-performance circuit materials in addition to supporting a technical symposium for printed-circuit-board (PCB) users and designers with a presentation on the effects of conductor metal surface roughness on high-frequency PCB performance.
Rogers will show a sampling of its material-based solutions, including 92ML™ thermal management materials. Designed to dissipate heat in high-power applications, thermally enhanced 92ML laminates and prepregs are halogen-free, flame-retardant thermally conductive epoxy-based thermoset materials with outstanding heat-transfer characteristics. They provide a cost-effective, lead-free-solder-compatible solution for effectively dissipating heat in multilayer circuit designs.
With a glass transition temperature (Tg) of +160C and high thermal conductivity of 2.0 W/m•K, 92ML materials can be supplied with copper cladding to 4 oz. thickness, to handle the most demanding heat-transfer requirements in power supplies and automotive electronics. When even greater cooling capability is needed, 92ML StaCool™ laminates are available with an insulated metal substrate (IMS). The IMS heatsink can be machined to a customer’s requirements, serving as part of the mechanical design in the final application.
Rogers’ thermal management materials also includes COOLSPAN® TECA adhesive film for bonding heatsinks to circuit materials with reliable thermal interfaces. This lead-free-process-compatible thermoset, epoxy-based, silver-filled adhesive film features outstanding thermal conductivity of 6 W/m•Kto ensure thermally stable bonds between heatsinks and PCB materials. COOLSPAN TECA represents a practical alternative to fusion bonding, sweat soldering, press-fit, and other methods for attaching circuits to heatsinks and other mechanical structures.
RO3003™laminates are ideal for loss-critical millimeter wave frequency designs, where consistent circuit performance matters, such as automotive radar sensors and point-to-point microwave backhaul communications systems. While already a benchmark for 77 GHz automotive radar sensors, RO3003 3.0 dielectric constant laminates are available with ½ ounce and 1 ounce rolled copper foil. Combining the very low dielectric loss of the RO3003 PTFE-ceramic resin systemwith smooth foil, results in high frequency circuit materials with best-in-class insertion loss. Also available with up to 0.040” thick copper plate.
Rogers CLTE-XT™ laminates also combine ceramic and PTFE materials to achieve excellent electrical and mechanical stability for a wide range of applications, from amplifiers to passive components. These materials are characterized by low coefficient of thermal expansion (CTE) in all three axes and stable Dk with temperature. They are well suited for phase-sensitive circuits including in microwave feed networks and in satellite-communications (satcom) systems.
Quick Turn Inventory Program
Visitors to Booth 201 can also learn about Rogers’ Quick Turn Inventory Program for North American fabricators. The program assists those faced with time-sensitive prototyping requirements by shipping select RO4000® circuit materials within two business days after receipt of order. Products included are: RO4003C™, RO4350B™, and RO4835™ laminates and RO4450B™ and RO4450F™ bondply materials.
Design Session Presentation by John Coonrod
As part of the Free Design Session, John Coonrod, Technical Marketing Manager, will present “Copper Foil Surface Roughness and its Effect on High Frequency Performance,” Wednesday, September 14, from 10 AM to 11 AM. The presentation details how the surface roughness of a PCB’s copper conductor can affect a circuit’s insertion-loss and phase performance, especially at higher frequencies.