Microwave Journal
www.microwavejournal.com/articles/26157-indiums-new-solder-paste-technology-exhibits-best-in-class-non-wet-open-performance

Indium's new solder paste technology exhibits best-in-class non-wet open performance

March 22, 2016

Indium Corp.'s new Indium10.8HF is a halogen-free, no-clean solder paste that is formulated to provide industry-leading non-wet open performance on large, high IO electronic packages, such as microprocessors.   

In addition to its resistance to non-wet opens, Indium10.8HF also delivers a superior oxidation barrier, allowing for reduced head-in-pillow (HiP) defects and improved graping performance. It also exhibits exceptional stencil printing, especially for small components (01005) and fast printing speeds (>125 mm/sec).

Indium10.8HF solder paste is part of Indium Corp.’s family of high-performance, lead-free, low-voiding, no-clean solder pastes that help manufacturers Avoid the Void™. For more information about Indium10.8HF, email askus@indium.com or visit www.indium.com/indium10.8HF.

For more information about Indium Corp. visit www.indium.com or email abrown@indium.com