Microwave Journal
www.microwavejournal.com/articles/26102-macom-announces-industrys-first-cwdm4-l-pic-for-100g-datacenter-applications

MACOM announces industry’s first CWDM4 L-PIC for 100G datacenter applications

March 10, 2016

M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high-performance RF, microwave, millimeterwave and photonic semiconductor products, announced the MAOP-L284CN, a silicon photonic integrated circuit integrated with lasers (L-PIC™) for a 100G transmit solution for CWDM4 and CLR4 applications.

To meet the explosive growth of data traffic driven by video and mobile, major Internet content providers, such as Amazon, Microsoft, Google and Facebook, are building hyper-scale datacenters, which require high-speed interconnect solutions that are power efficient, compact and cost optimized. MACOM’s Etched Facet Technology (EFT) lasers are attached to the Silicon PIC using its proprietary Self-Alignment process (SAEFT™) with high coupling efficiency, offering a power efficient solution at reduced manufacturing cost.

MACOM’s MAOP-L284CN features four high bandwidth Mach-Zehnder modulators integrated with four lasers (1270, 1290, 1310, and 1330 nm) and a CWDM multiplexer, with each channel operating at up to 28 Gb/s. The L-PIC™ operates on a standard single mode optical fiber, and includes integrated tap detectors for fiber alignment, system initialization and closed loop control. A single fiber aligned to the output edge coupler of this 4.1 x 6.5 mm die is the only optical requirement for implementing this device into QSFP28 transceiver applications. MACOM is also offering the MASC-37053A modulator driver integrated with CDR, matched with this L-PIC™ for optimized performance and power dissipation.

“Silicon-based photonic integrated circuits, or PICs, enable integration of optical devices such as modulators and multiplexer onto a single chip. We believe that MACOM’s L-PIC™ solves the key challenge of aligning lasers to the silicon PIC with high yield and high coupling efficiency, making the adoption of Silicon PICs a reality for high-speed optical interconnects within the Datacenter,” said Vivek Rajgarhia, Vice President of Strategy, High-Speed Networking, for MACOM.

MACOM’s L-PIC™ will be on display for private demonstrations at OFC 2016, Booth #3101, March 22-24th in Anaheim, CA. To make an appointment, contact your local sales representative. For more information on MACOM’s broad optical and photonic portfolio at OFC click here.

Visit www.macom.com for more information.