Microwave Journal
www.microwavejournal.com/articles/24620-edi-con-china-2016-call-for-papers

EDI CON China 2016 Call for Papers

June 24, 2015

EDI CON China 2016, taking place April 19-21 in Beijing at the China National Convention Center (CNCC), is pleased to announce their Call for Papers. Authors are invited to submit technical oral session abstracts/proposals describing work in RF/microwave, EMC/EMI and high-speed digital electronic component or system-level design, modeling or testing. The EDI CON Technical Advisory Committee will review all submissions based on quality, relevance, impact and originality. Prospective authors are welcome to reference products in a design case study or as a proof of concept for a design methodology, as long as product references are presented in an appropriately non-commercial fashion. The deadline for abstract submissions is October 31, 2015. Detailed information on formatting and instructions for submitting an abstract or paper are available at www.ediconchina.com/papers2016.

This year’s EDI CON China 2015 conference featured 95 technical papers sessions, 35 workshops, 9 plenary talks and 2 panel sessions with more than 2,400 attendees during the 3 day event. The technical sessions were organized around tracks focused on RF, microwave and high-speed digital design, RF/MW measurement and modeling, EMC/EMI, high-speed digital measurements and modeling, system-level measurements and modeling, and system engineering. A new 5G Forum with a full day of sessions and workshops was added this year and will be featured again in 2016. For more information about EDI CON China 2016, please visit www.ediconchina.com.

About EDI CON China

EDI CON China is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets. The technical program and exhibition include the leading international RFIC, component and material manufacturers, semiconductor foundries, EDA software and test equipment/solution providers. This year’s conference features the most recent trends in high-frequency electronics and wireless communication technology, addressing all aspects of design, simulation and test verification through an understanding of system requirements for wireless communication networks, such as small cell infrastructure, SATCOM and microwave backhaul.

About Horizon House

Horizon House is an experienced and well-established organizer of targeted events, including European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA), and several major microwave related conferences/exhibitions such as the RF/Microwave, M2M and Microwave Backhaul Zones at Super Mobility Week (CTIA).

Microwave Journal China, a Horizon House Publication and sister magazine of Microwave Journal, is promoting and publicizing EDI CON China to local engineers, technology companies and academia, while also providing input from, and a link to, the wider high speed, high frequency, RF and microwave community.

EDITORIAL CONTACTS:

North America:
Pat Hindle
+1 781 619 1946
PHindle@MWJournal.com
Twitter: @pathindle

International:
Richard Mumford
+44 207 596 8787
RMumford@MWJournal.com

China:
Katie Huang
+86-13910062975
katieh@actintl.com.hk