Microwave Journal
www.microwavejournal.com/articles/24116-dfr-solutions-announces-sherlock-40-with-powerful-new-modeling-features

DfR Solutions announces Sherlock 4.0 with powerful new modeling features

April 6, 2015

DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, announced the release of the most advanced version of Sherlock Automated Design Analysis™ software, version 4.0. The newest version of Sherlock allows users to model complex PCBs and components with exceptional detail, strengthening design decisions, saving significant time and money. Advanced features include an increased suite of FEA integration tools, lead modeling of surface mount and thru-hole components, substrate trace modeling, shock scoring, an expanded cutout editor, and a heatsink editor. 

The combination of Substrate Trace Modeling and a deeper integration with Abaqus and ANSYS® Workbench™ is the most powerful enhancement to the Sherlock software. This one-two punch allows for more rapid and detailed modeling of all substrate features, providing thermal/mechanical simulation teams at component companies much deeper insight into challenges with next-generation IC packaging, such as coreless substrates, ultra-thin BGAs (less than 1 mm thickness), multi-stack filled microvias, and 3D packaging. 

Sherlock’s Lead Modeler and Heatsink Creator now allow the user to automatically specify lead structures and heatsink architecture and attach for all electronic parts. These two new features along with the new Shock Scoring enable OEM engineers to assess performance of electronics that are subjected to repeated shock, such as door and trunk-mount electronics in automotive applications and wearable electronics embedded in athletic gear.

“The future of electronics is driven by two opportunities: 3D packaging and the Internet of Things.”, stated DfR Solutions CEO Craig Hillman.  “We at DfR Solutions have accentuated the application-specific advantage of Sherlock by introducing features that allow design teams to solve 3D packaging and IoT challenges earlier in the NPI process. The value of earlier insight is clear. One Sherlock customer recently estimated a six month reduction in time-to-market and an annual savings of $7.6M.” said Hillman. For more information regarding DfR Solutions, visit www.dfrsolutions.com.