Microwave Journal
www.microwavejournal.com/articles/23794-edi-con-seeing-double

EDI CON Seeing Double

February 16, 2015

EDI CON Seeing Double

In its third year, EDI CON China has the most exciting conference schedule ever. Taking place April 14-16 at the China National Convention Center (CNCC) in Beijing, the conference and exhibition will feature the latest practical sessions and workshops on popular topics such as IoT device design/characterization, GaN amplifier design, envelope tracking & DPD modeling/design, radar design/analysis, PCB design/characterization, WLAN design/measurement, MIMO design/testing, EMI modeling/testing and high speed design.

New this year is a full day 5G Forum that will include a plenary session from China Mobile about their outlook on 5G advanced communications technologies, followed by a panel session with experts from China Mobile, Shanghai Tech, Keysight Technologies, Rohde & Schwarz, National Instruments and MACOM. A series of eight sessions and two workshops will cover topics such as massive MIMO, HetNets, phased array transceivers, timing and synchronization, testing challenges, new modulation schemes and mmWave technologies.

Following the morning paper sessions on the first day will be a set of workshops before the afternoon plenary talks and VIP reception dinner. A couple of noteworthy tracks include amplifier design techniques with several talks on envelope tracking and another track on high frequency PCB design. The plenary talks will kick off with honorary Chairman, Professor Junde Song from Beijing University of Posts and Telecoms, discussing “Smart Cities and Communities.” Other scheduled speakers include Hongbing Ma from China Unicom discussing 5G future communications technologies and Wei Chen from China Mobile discussing IoT. The three major EDI CON sponsors will also speak with representatives from Keysight Technologies, Rohde & Schwarz and National Instruments covering their latest technologies and innovations. The Keysight sponsored VIP reception dinner will take place on-site shortly after the plenary talks. The second day has full day tracks focused on radar, IoT, systems design and high speed/EMI measurement and modeling. The third day will have a full morning of sessions with one set of workshops in the afternoon prior to the awards ceremony for best posters and papers.

The exhibition is bigger than ever with more than 100 companies participating. In addition to the three major sponsors, gold level sponsors include Mini-Circuits, Anritsu, Richardson RFPD/Arrow, CST, RFHIC and CETC41. These companies will be giving workshops on various topics along with ANSYS, MACOM, Peregrine, Gore, Rogers, Freescale, Arlon, H+S, Radiall, Win, Qorvo, Focus, Farran, Tektronix and Transemic. Workshops will cover various test & measurement and modeling solutions to today’s engineering challenges in amplifier design, envelope tracking and DPD, radar, EMI/EMC, LTE, 5G, MIMO/massive MIMO and IoT. Materials companies such as Rogers and Arlon will be discussing PCB design and cable/connectors companies such as H+S, Radiall and Gore will be covering connector design and cable solutions for testing and other high performance applications. Semiconductor solutions companies such as Richardson RFPD/Arrow, RFHIC, Freescale, MACOM, Peregrine, Transemic, NXP, WIN and Qorvo will be doing workshops on switching, filtering and amplifier solutions.

The EDI CON model with its practical, industry driven sessions and workshops has proven so successful that Microwave Journal and Horizon House are launching EDI CON USA in 2016, taking place September 20-22 in Boston, Mass. at the Hynes Convention Center. With all of its rich electronic design activity and history, the New England area is the perfect place to hold the first EDI CON USA event. EDI CON USA will partner with Keysight Technologies, as they do with EDI CON China, as their host sponsor and will offer key sponsorships to its other EDI CON China partners such as Rohde & Schwarz, National Instruments, Mini-Circuits, Anritsu, Richardson RFPD, CST, ANSYS and RFHIC. The first EDI CON USA event hopes to draw thousands of engineers from its sponsors, international electronic design companies and local New England companies such as Raytheon, BAE Systems, Mercury Systems, Cobham, Skyworks, MACOM, Qorvo, ADI/Hittite and Rogers Corp. Other future locations with large, high frequency design communities will be considered for future EDI CON USA events.

It is going to be an exciting year with hot beds of activity already taking place in areas such as IoT, 5G, radar and UAVs. Microwave Journal will strive to bring you the best articles, webinars and conferences to keep you informed about the latest technologies and techniques being developed throughout the industry.