Microwave Journal
www.microwavejournal.com/articles/23725-nxp-and-cohda-wireless-roadlink-achieve-top-performance-in-audi-field-trial

NXP and Cohda Wireless RoadLINK achieve top performance in Audi field trial

January 20, 2015

Leading premium car brand, Audi AG, has concluded an extensive field test of NXP Semiconductors and Cohda Wireless vehicle-to-vehicle (V2V) communications technology in Ingolstadt, Germany.

NXP, the first supplier to deliver V2X chipsets for mass-production-ready secure connected cars, and Cohda Wireless, the leading software supplier for IEEE 802.11p based communication, have joined forces to provide auto manufacturers with a range of ‘best-in-class’ V2X technologies that sets the benchmark for high performance, reliability and security.

In high speed challenges, V2V-enabled Audi vehicles equipped with the NXP RoadLINK™ chipset drove towards one another at relative speeds of up to 500 kilometres per hour, communicating across distances of more than two kilometres.

According to Audi, RoadLINK™ delivered excellent results in the reliability of wireless exchange of warnings, reception performance, and communication range in real traffic conditions and at high speeds. The RoadLINK™ chipset cut reaction time and communicated potential hazards and safety-critical scenarios significantly faster than conventional wireless technology.

The field test featured the intelligent roof antenna developed by the automotive supplier, Delphi, based on the NXP and Cohda Wireless RoadLINK™ chipset. An NXP hardware secure element was also used to protect the communications from manipulation and unauthorized tracking or data access.

Aurel Papp, head of development EMC/Antenna Components, Audi AG, explained, “The NXP RoadLINK™, chipset combined with the Delphi Automotive PLC roof antenna, delivered the best results so far in our field tests. In challenging test environments, such as intersections in the forest (trees absorb wireless signals at 5.9 GHz), the range was better than the previously tested systems. The results demonstrate the benefit of combining NXP’s RoadLINK™ solutions with the circuit layout and design of the passive antenna emitters by Delphi.”

Andrew Turley, senior director of innovation & V2X program manager, NXP Semiconductors, explained, “The powerful combination of NXP and Cohda Wireless provides auto manufacturers with the secure connections they need to be a part of tomorrow’s smart and connected automotive world.”

Turley continued,"The motto of the Audi, NXP partnership is ‘Role Model of Innovation & Speed’. Once again, the high standards of performance, reliability and security provided by the NXP and Cohda Wireless RoadLINK™ chipset were demonstrated in challenging trials with a premium automobile manufacturer.”