Microwave Journal

RFHIC joins EDI CON 2014 as a Gold sponsor

Leading GaN-based RF power amplifier manufacturer will share its expertise in wideband, high performance devices with Chinese designers and wireless infrastructure system integrators

December 6, 2013

Horizon House publications and Microwave Journal China announced the participation of RFHIC, a global leader in the design and manufacture of RF & Microwave components, as a Gold sponsor of the 2014 Electronic Design Innovation Conference (EDI CON 2014) to be held April 8–10, 2014 at the Beijing International Convention Center in Beijing, China. RFHIC will share its expertise in Gallium Nitride (GaN)-based high RF/microwave power amplifiers commonly found in mobile communication systems and wireless infrastructure with conference and exhibition attendees.  

RFHIC will present two separate workshops on GaN transistor technology and hybrid amplifier technology, providing conference delegates with an update on the current state of commercially available GaN devices and a roadmap of technology currently in development. Exhibition attendees will also be able to meet with company experts for demonstrations on GaN transistor and hybrid amplifier to be held in the RFHIC booth #604 located in the East Hall of the BICC.

EDI CON is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets. The technical program and exhibition includes the leading international RFIC, component and material manufacturers, semiconductor foundries, EDA software and test equipment/solution providers. This year’s conference features the most recent trends in high-frequency electronics and wireless communication technology, addressing all aspects of design, simulation and test verification through an understanding of system requirements for wireless communication networks such as small cell infrastructure, SATCOM and microwave backhaul.

RFHIC prides itself on being a 'one-stop facility' solution provider, capable of processing MMIC, die attach, wire bonding, packaging, chip on board, SMT line, RF test line, and quality control actions all in their facilities. As an EDI CON 2014 Gold sponsor, RFHIC looks to inform the China RF/microwave community about its low cost, high performance solutions while expanding its sales and marketing to this growing market.