DesignCon 2014 announces technical program and expo highlights
UBM Tech, the electronics industry’s daily source of essential business and technical information, released the DesignCon 2014 technical program. Created by engineers for engineers, DesignCon’s award-winning technical program provides attendees with four days of intensive technical learning and networking opportunities, enabling chip, board and systems designers, software developers and silicon manufacturers to expand their design expertise. DesignCon will be held January 28-31, 2014 in Santa Clara, CA.
The DesignCon technical planning committee, comprised of leading engineers and technologists from global organizations, diligently crafted the conference program from 1,000’s of technical papers submitted. As a result, the 2014 event will comprise 120+ cutting-edge technical tutorials, panel discussions and case studies divided into 14 tracks addressing the latest design theories, methodologies, applications and technologies in signal integrity for all levels of electronic design including chip, package, board and systems. DesignCon’s newest conference track, Wireless and Photonic Design & Integration, will provide a forum covering the practices and methodologies used in emerging system designs and applications leveraging wireless and photonic technologies as media for data transmission.
The 2014 DesignCon Expo will feature over 150 top-tier exhibitors, live product teardowns, visionary keynote speakers, interactive Chiphead Theater sessions and educational forums. Host sponsor Agilent Technologies will also be offering the Agilent Education Forum, a free technical education and training workshop. As such, chip, board and systems design engineers and engineering managers will learn about and evaluate the latest technologies and solutions, connect with new and current vendors and make new industry contacts.
“As the largest gathering of chip, board and systems designers in the world, DesignCon is devoted to providing attendees with unique educational opportunities focused on the latest technical advancements in the high speed design, signal integrity and test and measurement fields,” said Katie Stern, conference manager of DesignCon at UBM Tech. “As a result, the electronics and semiconductor industries rely on DesignCon to inform them of state-of-the-art technologies and developments.”
Attendees of DesignCon 2014 can expect to learn new ways to optimize their designs to ensure signal and power integrity, overcome verification challenges and mitigate jitter, crosstalk and noise. The industry gathers at DesignCon to exchange information about the new methodologies and best practices being used in emerging systems designs, applications and analysis.