Rogers to offer material solutions for high-frequency, high-thermal-reliability & multilayer circuits at PCB West 2013
Rogers Corp. will have representatives available to discuss electronic printed-circuit-board (PCB) material solutions at the PCB West Exhibition (http://pcbwest.com), September 25, 2013, in the Santa Clara Convention Center in Santa Clara, CA (Booth #200).
Rogers will be highlighting its new high-Dk RO4360G2™laminate and 2929 bondply materials. In addition to comparing different circuit materials at the Rogers’ booth, PCB West Conference attendees can learn more about rapidly growing wireless voice, video, and data link market opportunities at millimeter-wave frequencies (above 30 GHz) and the special material requirements needed for optimal performance by attending John Coonrod’s conference session entitled “Electrical Challenges for PCB Millimeter-Wave Applications.” Hispresentation will be held on Sept. 25th at 11 AM.
Rogers will also be promoting its new RO4835™ high-frequency laminate material which provides 10 times improved oxidation resistance compared to legacy RO4000® laminate materials. As with its popular RO4350B™ laminates, Rogers RO4835 circuit materials exhibit a dielectric constant of 3.48 and a low loss tangent of 0.0037 at 10 GHz, plus low z-axis coefficient of thermal expansion (CTE) for reliable plated-through-holes. RO4835 circuit material is RoHS compliant and can be processed using standard fabrication methods.
Rogers’ 2929 bondply material is well suited for the design and fabrication of reliable multilayer circuits with many of the company’s high-performance core materials, including Rogers RT/duroid®, RO3000®, and RO4000 laminates. The 2929 bondply material is a thin adhesive film that is available in various thicknesses, such as 1.5, 2.0, and 3.0 mils, and sheets of 2929 materials can be stacked to create thicker layers as needed. The material incorporates a proprietary cross-linking resin system that supports sequential lamination processing. It also features controlled flow characteristics for excellent results when filling blind viaholes. This unreinforced thermoset adhesive film has a low dielectric constant of 2.94 in the z-axis at 10 GHz and low dissipation factor of less than 0.003 at 10 GHz.
Also possessing improved oxidation resistance, recently introduced RO4360G2 laminates are formulated for improved thermal reliability which will help fabricators achieve higher UL MOT’s, and with a high dielectric constant of 6.15 at 10 GHz, they are well suited for power-amplifier designers who need to meet challenging PCB board size reduction targets in a cost effective manner. The higher dielectric constant enables smaller circuit dimensions for a given wavelength and frequency, allowing a significant reduction in finished circuit-board size (typically 25% to 30%). The RO4360G2 laminates can be processed like FR-4 materials. They are compatible with most automated assembly techniques and provide the reliability and repeatability that customers have learned to expect from Rogers RO4350B laminates.