EDI CON Connectivity Workshop & Expert Panel to explore application-based solutions
EDI CON 2013 (March 12-14, Beijing, China), the industry-driven event for RF, microwave and high speed digital electronic design organized by Microwave Journal and Horizon House, has announced a special workshop focusing on connectivity challenges and innovations for high-frequency systems and instrumentation equipment to be held on March 14th at the Beijing International Convention Center.
The Connectivity Workshop and Expert Panel, a special event within EDI CON, will give Chinese RF/microwave and high-speed design engineers an opportunity to learn about various cable, connector and cable assembly technologies in the context of overall high frequency electronic component design and system integration. The combined workshop and panel session will feature individual presentations from some of the world’s leading cable/connector vendors followed by a group panel discussion on the capabilities of today’s RF, microwave and high-speed interconnects and the challenges of the systems they support.
Speakers from Mitron, Insulated Wire (IW), Times Microwave, Maury Microwave, and Southwest Microwave will present various connector technologies and their corresponding electrical and mechanical characteristics. These talks will concentrate on connector performance, examine how cable/connector attributes align to high-frequency application requirements and guide engineers who require help in selecting the appropriate interconnect solutions for the systems and instrumentation equipment they are developing. The workshop will complement several papers presented in the technical sessions that focus on cable and backplane modeling for RF and high-speed design.
More information on the conference can be found at www.ediconchina.com.