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ProPlus Design Solutions Inc. and MPI Corp. announced a strategic partnership agreement and immediate availability of a characterization and modeling solution that integrates ProPlus’ SPICE modeling and noise characterization solution with MPI’s advanced probing technologies.
Smiths Interconnectannounces the release of the Volta Series probe heads optimized for wafer level chip scale package testing. Volta is used for testing the chips (while in their wafer form) that are behind everything from Bluetooth and power management to digital display controllers. Volta helps customers deliver higher quality products by ensuring the chips in them are up to specification, and perform as they should.
Smiths Interconnect, a leading provider of technically differentiated electronic components, subsystems, microwave and radio frequency products, announces today the release of the Volta Series probe heads optimized for wafer level chip scale package testing.
Altair Engineering, Inc., has announced that the 10th Altair Technology Conference (ATC) will take place at the British Motor Museum, Gaydon on 19th September 2017.
The latest release of NI AWR Design Environment, V13, will be on display at the Electronic Design Innovation Conference (EDI CON) 2017, being held
in Shanghai, China on April 25-27. In addition to software demonstrations within NI Booth #311, the NI AWR software product portfolio will be featured in one 40-minute workshop and two 20-minute technical sessions. NI AWR software activities during EDI CON include:
The Keysight U3800 Series Internet of Things (IoT) applied courseware includes ready-to-teach materials focused on practical IoT design and test techniques. The courseware was developed as a resource for educators with a goal of ensuring students are well-prepared to meet the challenges of today's IoT industry.
Version 13, the first major update in 2017 to NI AWR Design Environment, has been released. V13 provides key new capabilities and major enhancements to better address the design challenges associated with highly-integrated RF/microwave components commonly found in communications, phased-array radar and other electronic systems.
efabless Corp., an open-innovation, hardware creation platform, became the first online marketplace for community-developed, customized intellectual property (IP) and integrated circuits (ICs), allowing hardware system innovators to turn ideas into marketable products. Initially focused on analog and mixed-signal design for customized ICs, efabless addresses all of the steps required to cost effectively take an electronics specification to prototype.
Bringing together engineers working in RF/microwave with those working in high-speed digital, EDI CON USA offers an opportunity to learn from other disciplines and transfer techniques and methods between applications. The exhibit floor will include booths from industry-leading companies working in both of these areas, as well as feature the SI ZONE, a specialized demo area for signal integrity, power integrity and EMI/EMC products.
Version 13, the first major update in 2017 to 
Bringing together engineers working in RF/microwave with those working in high-speed digital, EDI CON USA offers an opportunity to learn from other disciplines and transfer techniques and methods between applications. The exhibit floor will include booths from industry-leading companies working in both of these areas, as well as feature the SI ZONE, a specialized demo area for signal integrity, power integrity and EMI/EMC products.