Articles Tagged with ''thermal''

TRAK Microwave's GaN SSPA powers ku band block upconverter

 The model MFC147 from TRAK Microwave provides 13.75 to 14.50 GHz coverage for civilian and military aviation Ku-band SATCOM applications, including In-Flight Entertainment (IFE) systems and UAV communications. The unit features a ruggedized design and innovative thermal management technique to withstand challenging airborne environments utilizing SMT construction with no open die. Input frequency to the Block Upconverter (BUC) is 950-1700 MHz, with Ku-band output of +12 to +17 dBm.  An integrated, low-noise, GaN, Solid State Power Amplifier (SSPA) provides 25 watts minimum output power providing better than -120 dBc/Hz noise power (-140 dBc/Hz typical) and <-22 dBc spectral regrowth (OQPSK). 

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Element Six's GaN-on-diamond wafers proven by Raytheon to provide three times improvement in power density

Element Six, a leader in synthetic diamond supermaterials and a member of the De Beers Group of Companies, announced that its Gallium Nitride (GaN)-on-Diamond wafers have been proven by Raytheon Co. to significantly outperform industry standard Gallium Nitride-on-Silicon Carbide (GaN-on-SiC) in RF devices—reducing thermal resistance, increasing RF power density, and preserving RF functionality.

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TEGAM awarded patent for advanced thermistor design

TEGAM Inc., a leading supplier of innovative RF power measurements, was recently awarded Patent No. 8,558,556, “Planar-axial thermistor for bolometry.” This patent describes a novel way to construct very small planar thermistors on a substrate with very low heat transfer. The thermistors are more thermally isolated from the environment than are commercially-produced thermistors. Both the small size and thermal isolation make them useful for measuring RF power at microwave frequencies up to 70 GHz.

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