Articles Tagged with ''thermal''

SANTIER will be presenting their CTE matching high thermal conductivity metals and ceramic packages at IMS2015 in Phoenix, Ariz., May 17-22.

 The model MFC147 from TRAK Microwave provides 13.75 to 14.50 GHz coverage for civilian and military aviation Ku-band SATCOM applications, including In-Flight Entertainment (IFE) systems and UAV communications. The unit features a ruggedized design and innovative thermal management technique to withstand challenging airborne environments utilizing SMT construction with no open die. Input frequency to the Block Upconverter (BUC) is 950-1700 MHz, with Ku-band output of +12 to +17 dBm.  An integrated, low-noise, GaN, Solid State Power Amplifier (SSPA) provides 25 watts minimum output power providing better than -120 dBc/Hz noise power (-140 dBc/Hz typical) and <-22 dBc spectral regrowth (OQPSK). 

inTEST Thermal Solutions (iTS) has designed a multi-zone thermal plate for hot/cold temperature cycling of microwave signal amplifiers used in satellite data communications.

RFMW Ltd., announces design and sales support for MAST Technologies' line of dual use RF absorber & thermally conductive pad material. Trademarked Suppress-n-Sink, the target application is reducing harmful reflections from heat-sinks and heat-spreaders used on packaged components.

Freescale Semiconductor, the global leader in radio frequency (RF) power transistors, introduced the industry’s highest thermal and wideband performance GaN device with a 125 W continuous wave (CW) GaN-on-SiC transistor.

Element Six, an industry leader in synthetic diamond supermaterials and member of the De Beers Group of Companies, announced the development of a new thermal grade of diamond grown by chemical vapor deposition (CVD), DIAFILM TM130. 

 Bonding Source, the industry’s leading supplier of epoxy pastes and films for the RF Microwave industry, introduces the latest from NAMICS for applications requiring high thermal conductivity.  

Element Six, a leader in synthetic diamond supermaterials and a member of the De Beers Group of Companies, announced that its Gallium Nitride (GaN)-on-Diamond wafers have been proven by Raytheon Co. to significantly outperform industry standard Gallium Nitride-on-Silicon Carbide (GaN-on-SiC) in RF devices—reducing thermal resistance, increasing RF power density, and preserving RF functionality.

Indium Corp. technology experts will present at PCIM Europe May 20–22 in Nuremberg, Germany

TEGAM Inc., a leading supplier of innovative RF power measurements, was recently awarded Patent No. 8,558,556, “Planar-axial thermistor for bolometry.” This patent describes a novel way to construct very small planar thermistors on a substrate with very low heat transfer. The thermistors are more thermally isolated from the environment than are commercially-produced thermistors. Both the small size and thermal isolation make them useful for measuring RF power at microwave frequencies up to 70 GHz.