Chen, Richard, Neal Mellen, Makoto Shibata and Masahiro Miyazaki
“A Compact Thin-film WLAN Antenna Switching Module,” No. 1, p. 130.

Chen, Wen-Shan and Fu-Mao Hsieh
“A Broadband Design for a Printed Isosceles Triangular Slot Antenna for Wireless Communications,” No. 7, p. 98.

Go, Hyun-Chul and Yong-Woong Jang
“Characteristic Analysis of a Low Profile Post-type Monopole Antenna with Dual Plate,” No. 5, p. 260.

Goldberg, Bar-Giora
“Introduction to Miniature Antenna and Diversity Combining Techniques,” No. 1, p. 86.

Lee, S.K., A. Sambell, E. Korolkiewicz, S.F. Loh, S.F. Ooi and Y. Qin
“A Design Procedure for a Circular Polarized, Nearly Square Patch Antenna,” No. 1, p. 116.

Malouf, Perry M. and Robert E. Wallis
“The Medium-gain Antenna of the MESSENGER Spacecraft,” No. 10, p. 100.

Petosa, A. and A. Ittipiboon
“Design Curves for Estimating the Resonant Frequency and Q-factor for Rectangular Dielectric Resonator Antennas,” No. 5, p. 250.

Podduturi, Bharadvaj and David M. Pozar
“Lightweight, Low Cost Printed Antenna Arrays,” No. 1, p. 106.

Thaysen, Jesper and Kaj B. Jakobsen
“A Size Reduction Technique for Mobile Phone PIFA Antennas Using Lumped Inductors,” No. 7,p. 114.

Vidmar, Matjaz
“An Archery-target Antenna,” No. 1, p. 222.

Warnagiris, T.
“A Monopole with a Twist Revisited,” No. 7, p. 54.


Abd-Alhameed, D. Zhou, N.J. McEwan, P.S. Excell and A. Ghorbani
“A CAD-oriented Approach to Design of Load Impedance and Input Matching in Active Transmitting Antennas,” No. 3, p. 98.

Bera, S.C., R.V. Singh and V.K. Garg
“A Temperature Dependent PIN Diode Model for Simple Temperature Invariant Attenuator Circuits,” No. 2, p. 104.

Chen, Xiaoming
“EM Modeling and Circuit Simulation Lead to a Solution to Amplifier Oscillations,” No. 6, p. 102.

Kyhala, J. and M. Andersson
“An Advanced PIN-diode Model,” No. 9, p. 206.

Sertbas, Ahmet
“A CAD Algorithm for RF/Microwave Interconnect Modeling,” No. 3, p. 84.

Wedge, Scott, Evgeny Wasserman, and David Neilson
“Transient Simulations at RF Frequencies,” No. 3, p. 116.


Vidmar, Matjaz
“An Improved Microwave Weed Killer,” No. 10, p. 116.


Banham, R. and G. Valsecchi
“Electroformed Front-end at 100 GHz for Radio-astronomical Applications,” No. 8, p. 112.

Cabral, Pedro Miguel, Jose Carlos Pedro and Nuno Borges Carvalho
“A Unified Theory for Nonlinear Distortion Characteristics in Different Amplifier Technologies,” No. 4, p. 62.

Chung, Younkyu, Dal Ahn and Tatsuo Itoh
“A Quasi-balanced Frequency Doubler Using Alternate Power Dividing and Combining Techniques,” No. 5, p. 198.

Dell’Aera and Tom Riley
“Sampling IF Filters and the Return of the Superheterodyne Receiver,” No. 11, p. 86.

DeWolf, Ingrid, Piotr Czarnecki, Anne Jourdain, Robert Modlinski, Harrie A.C. Tilmans, Robert Puers, Joost T.M. van Beek and W. Merlijn van Spengen
“The Influence of the Package Environment on the Functioning and Reliability of Capacitive RF-MEMS Switches,” No. 12, p. 102.

Fung, Clifford
“Industry Study on Issues of MEMS Reliability and Accelerated Lifetime Testing,” No. 9, p. 186.

Gorbachov, Oleksandr
“RF Linear Power Amplifier Gain Stabilization Over Ambient Temperature,” No. 12, p. 82.

Hsu, Cheng-Ying, Chu-Yu Chen and Chuang Hao Huang
“A UWB Filter Using a Dual-mode Ring Resonator with Spurious Passband Suppression,” No. 11, p. 130.

Jeong, Hyeong Tae, Tae Ho Kim, Ik Soo Chang and Chul Dong Kim
“A Doherty Amplifier with a Bias Adaptation Technique Based on SDR Transmitter Architecture,” No. 9, p. 140.

Jeong, Yong-Chae, Do-Kyeong Hwang and Jong-Sik Lim
“A Novel Frequency Doubler Using a Feedforward Structure and DGS Microstrip for Fundamental and High Order Components Suppression,” No. 5, p. 212.

Jia, Pengcheng
“A 2 to 20 GHz High Power Amplifier Using Spatial Power Combining Techniques,” No. 4, p. 108.

Kameche, M.
“GaAs-, InP- and GaN HEMT-based Microwave Control Devices: What is Best and Why,” No. 5, p. 164.

Le, Khanh Tuan
“Transceiver Design for IEEE 802.15.4 and Zigbee-compliant Systems,” No. 9, p. 160.

Park, Kyu-Ho, Hee-Seok Song and Yong-Chae Jeong
“A Compact LTCC Bandpass Filter Using Resonators Loaded with Spiral-shaped Open-circuited Stubs,” No. 10, p. 128.

Qiang, Lin, Zhang Zu Ying and Guo Wei
“Design of a Feedback Predistortion Linear Power Amplifier,” No. 5, p. 232.

Sawicki, Andrzej
“A New Class of Asymmetical Directional Couplers for Power/Antenna Control Applications,” No. 11, p. 102.

Vendelin, George D., Jose Carlos Pedro and Pedro Miguel Cabral
“Amplifier and Transistor Gains Revisited,” No. 4, p. 80.

Wang, Chunlei, Christopher T. Rodenbeck and Kai Chang
“A Four-channel Full-duplex T/R Module for Multi-frequency Phased Array Applications,” No. 4, p. 94.

Yeap, Y.W., E.C. Teh and T.W. Chua
“Design of Linear S-band Power Amplifiers with High Power-added Efficiency,” No. 4, p. 120.

Yen, Cheng-Chi and Huey-Ru Chuang
“2.4 GHz, 0.25 mm CMOS Transmitter and Receiver RFICs for Wireless Communications,” No. 2, p. 56.

Zhang, Yewen, Li Hi, Hongqiang Li and Hong Chen
“Experimental Investigation of a Power Divider Based on Microstrip and Metamaterials with L-C Lumped-elements,” No. 11, p. 114.


Alinikula, Petteri
“Multiradio Yields Challenges for Mobile Phones,” No. 7, p. 22.

Bacon, Peter, Chandra Mohan, David Fryklund and Peter Zampardi
“Semiconductor Trends in Wireless Handsets,” No. 6, p. 22.

Barton, David K.
“Radar Today,” No. 1, p. 24.

Cripps, Steve C.
“RF Power 2005,” No. 4, p. 22.

Howe, Jr., Harlan
“Passive Components: A Brief History,” No. 11, p. 22.

McKenna, Ted
“Commercial Software Marches to Battle,” No. 10, p. 22.

Neal, Jerry D.
“The RF Semiconductor Evolution: From Single Components to System Solutions,” No. 2, p. 22.

Newman, Tom
“Millimeter-wave Satellite Remote Sensing,” No. 8, p. 22.

Rautio, James C.
“Planar Electromagnetic Software — Personal Reflections,” No. 3, p. 22.


Holtzman, Ronen
“A Study of Transition Effects in Supercomponents,” No. 2, p. 94.

Kim, Young, Ik-Soo Chang and Yong-Chae Jeong
“An Analog Predistortion Linearizer Design,” No. 2, p. 118.

Morgan, Matthew and Sander Weinreb
“Techniques for the Integration of High-Q Millimeter-wave Filters in Multi-function MMIC Modules,” No. 5, p. 182.

Myoung, Seong-Sik and Jong-Gwan Yook
“A Miniaturization Method of Parallel Coupled-line Filters Using Lumped Capacitors and Grounding,” No. 6, p. 94.

Yang, Seong-Sik, Jong-Hwan Lee and Kyung-Whan Yeom
“Design and Implementation of a Novel Frequency Modulation Circuit Using a Phase-locked Loop Synthesizer,” No. 2, p. 80.

Yeap, Y.W.
“Ultra Wideband Signal Generation,” No. 9, p. 172.

Zhang, Fei, Chengfang Li and Lina Shi
“CPW Transmission Insertion Loss on Si and SOI Substrates,” No. 11, p. 138.

Test and Measurement

Baylis, Charles, Lawrence Dunleavy and Bill Clausen
“The Importance of Sweep Rate in DC IV Measurements,” No. 3, p. 130.

Blackham, Dave and Ken Wong
“Latest Advances in VNA Accuracy Enhancements,” No. 7, p. 78.

Bridge, J.P.
“Making Thermal Resistance Measurements without Test Diodes or Thermal Stages,” No. 11, p. 122.

Reyes, Steve
“De-embedding Using a Vector Network Analyzer Including Calibration and Measurement Techniques,” No. 3, p. 64.

Yoh, Yuping
“Detecting Fast RF Bursts Using Log Amps,” No. 2, p. 128.


Penn, John. E.
“A Balanced Ka-band Vector Modulator MMIC,” No. 6, p. 82.


Aeroflex Inc.
“Satellite In-orbit Group Delay Measurement Using a Microwave System Analyzer,” No. 3,
p. 146.

Agilent Technologies, EEsof EDA Division
“A 3D Planar EM Modeling Simulator with a New, 64-bit Engine,” No. 9, p. 220.

Ansoft Corp.
“Addressing High Performance Design,” No. 9, p. 234.

Applied Wave Research Inc.
“Breaking the EDA Interoperability Barrier,” No. 11, p. 144.

AVX Corp.
“A Harmonic Low Pass Filter with a Lead-free LGA Termination,” No. 11, p. 158.

Cascade Microtech Inc.
“Calibration Technology Enabling 67 GHz Multiport S-parameter Measurement with Confidence,” No. 12, p. 140.

“A Common Test Software Platform for High Performance Automatic Test Systems,” No. 3, p. 140.

Fairchild Semiconductor Corp.
“High Efficiency Power Amplifier Modules for Mobile Handset Applications,” No. 2, p. 156.

Fairchild Semiconductor Corp.
“A Quad-band GSM/EDGE PA Module,” No. 9, p. 231.

Filtronic Compound Semiconductors
“Power PHEMT Advantages in Infrastructure Requirements,” No. 4, p. 138.

Focus Microwaves
“A High Power, High Speed 100 MHz Programmable Tuner,” No. 3, p. 164.

Freescale Semiconducteurs S.A.S.
“A 60 W RF Transistor in a Cost-effective Plastic Package for 2 GHz Cellular Applications,” No. 5, p. 274.

Hittite Microwave Corp.
“GaAs MMIC I/Q Mixers for IRM and SSB Converters in Microwave Radio Applications,” No. 2, p. 160.

Huber & Suhner
“A Self-extinguishing Gas Capsule Protector,”
No. 7, p. 136.

International Manufacturing Services Inc. (IMS)
“High Performance L- and S-band SMT Harmonic Filters for RF Applications,” No. 5, p. 280.

Jacket Micro Devices Inc. (JMD)
“A Laminated-based RF Integrated Passive Device,” No. 2, p. 168.

M/A-COM Inc.
“Silicon-based Surface-mount I-Q Modulators/Demodulators for RFID and Wireless Applications,” No. 5, p. 284.

M/A-COM Inc.
“High Linearity RF Driver Amplifier Family for Wireless Communications Applications,” No. 10, p. 152.

Micro-Ant Inc.
“A Low Profile, L-band Mobile Tracking Antenna System,” No. 1, p. 162.

“A Solid-state, 1 to 2 GHz, 1 kW Amplifier,” No. 8, p. 128.

Mimix Broadband Inc.
“A 500 MHz to 6 GHz Dual, Ultra Low Noise, High IP3 Amplifier,” No. 9, p. 238.

“DC to 18 GHz Test Cables,” No. 5, p. 292.

Modelithics Inc.
“Nonlinear Diode Models for Enhanced Simulation Accuracy,” No. 3, p. 14.

Nurad Technologies Inc.
“Sprial Antennas for Broadband Applications,” No. 1, p. 154.

Omron Electronic Components LLC
“A Coaxial High Frequency Relay for 26.5 GHz Applications,” No. 7, p. 142.

ORBIT/FR – Europe GmbH
“A Portable Compact Range-based Antenna Measurement System,” No. 4, p. 134.

Peregrine Semiconductor Corp.
“An Ultra-linear SP7T Handset Antenna Switch for GSM/PCS/EDGE/WCDMA Applications,” No. 12, p. 162.

Renaissance Electronics Corp.
“A Broadband Circulator Covering 225 to 400 MHz,” No. 6, p. 126.

RF Micro Devices Inc.
“The Case for Transmit Modules (TxM),” No. 6, P. 108.

Richardson Electronics Ltd.
“A Low Noise Amplifier Family for Wireless System Applications,” No. 11, p. 162.

Rohde & Schwarz
“A Vector Signal Generator for Production Applications,” No. 3, p. 160.

Rohde & Schwarz
“A 24 GHz Network Analyzer,” No. 10, p. 136.

Sirenza Microdevices
“Standard 5 V Medium Power InGaP Darlington Amplifiers,” No. 5, p. 266.

Skyworks Solutions Inc.
Complete Transmit Solutions Using a Quad-band Tx/Rx Front-end Module with Integrated Power Control,” No. 12, p. 150.

Sophia Wireless Inc.
“A 125 W Pulsed Ku-band Power Amplifier,” No. 11, p. 152.

SUSS MicroTec Test Systems
“Calibration Software for Automated Multiport Wafer Level Testing,” No. 10, p. 144.

Synergy Microwave Corp.
“Distributed Coupled Voltage-controlled Oscillators,” No. 7, p. 140.

Teledyne Relays
“A Miniature 10 GHz Surface-mount Relay,” No. 1, p. 166.

Times Microwave Systems
“A Novel Super-robust Handgrip for Coaxial Connector Assemblies,” No. 8, p. 134.

TriQuint Semiconductor
“A High Performance GSM Quad-band PA Module with Breakthrough Size Reduction,” No. 4, p. 128.

Valpey Fisher Corp.
“A High Frequency Reference Module,” No. 4, p. 142.

Vector Fields Inc.
“Design Software Offering both FDTD and MoM Analysis,” No. 6, p. 114.

Vectria Ltd.
“A New Concept for RF and Microwave
In-circuit Testing and Debugging of Multifunction Boards,” No. 6, p. 120.

WJ Communications Inc.
“Highly Linear 12 V Power Amplifiers for Wireless Infrastructure Applications,” No. 8, p. 138.

Zeland Software Inc.
“EM-based Design Software for Spiral Inductors and Transformers,” No. 5, p. 288.


Buchin, B. and R. Leschhorn
“Next-generation Radios: New Paths for Communications,” No. 10, p. 92.

Cheadle, Shawn
“Export Compliance: Understanding ITAR and EAR,” No. 10, p. 80.

Mumford, Richard
“EuMW 2004 – History in the Making,” No. 1, p. 140.

Mumford, Richard
“Microwaves in Europe: Technologies, Trends and Prospects,” No. 9, p. 88.

Sheffres, Carl
“A New Year, a New Look, the Same Mission,” No. 1, p. 14.

Wells, Jonathan
“Multi-gigabit Connectivity at 70, 80 and 90 GHz,” No. 7, p. 128.


Henley, Allen
“WiMAX-A Standard Air Interface for Broadband Wireless Access,” No. 5, p. 242.

Persico, Raffaele and Francesco Soldovieri
“Effects of the Radiated Power in a Linear Inverse Scattering Algorithm for GPR Prospecting: Numerical Results,” No. 1, p. 60.

Thaysen, Jesper and Kaj B. Jakobsen
“Estimation of the Optimal Location of Metallic Objects Inside a Mobile Phone,” No. 9, p. 196.


Aubin, John F.
“A Brief Tutorial on Antenna Measurements,” No. 8, p. 92.

Fei, Louis Fan
“Sub-harmonic Mixer IC Designs and Enhancement Techniques,” No. 9, p. 214.

Grebennikov, Andrei
“Transistor LC Oscillators for Wireless Applications: Theory and Design Aspects, Part I,” No. 10, p. 62.

Grebennikov, Andrei
“Transistor LC Oscillators for Wireless Applications: Theory and Design Aspects, Part II,” No. 11, p. 60.

Grebennikov, Andrei
“Transistor LC Oscillators for Wireless Applications: Theory and Design Aspects, Part III,” No. 12, p. 118.

Hausman, Howard
“The Effect of High Stability Reference Oscillators on System Phase Noise,” No. 2, p. 140.


European Microwave Exhibition 2005
No. 9, p. 58.

Mumford, Richard
“Attending European Microwave Week 2005,” No. 9, p. 28.

Proust, Lise
“Paris: Forever and for Everyone,” No. 9, p. 44.

Quere, Raymond and Charles Ayotte
“Welcome to European Microwave Week 2005,” No. 9, p. 24.


Bashore, Frank
“An Upbeat IMS 2005 in Long Beach,” No. 8, p. 74.

Howe, Jr., Harlan
“Attending the Conference,” No. 5, p. 30.

Jackson, Charlie
“Welcome to the 2005 International Microwave Symposium,” No. 5, p. 28.

Maas, Julie and Steve
“Life in Long Beach,” No. 5, p. 42.

Long Beach Convention Center Floor Plan
No. 5, p. 76.

2005 IEEE MTT-S IMS Exhibitors
No. 5, p. 66.

2005 IEEE MTT-S IMS Technical Program
No. 5, p. 80.


Howe, Jr., Harlan
“Attending the Conference,”
No. 12, p. 26.

Schindler, Fred
“Welcome to the 2006 Radio and Wireless Symposium,” No. 12, p. 22.

2006 IEEE MTT-S RWS Exhibitor Showcase
No. 12, p. 32.


Agilent Technologies, EEsof EDA Division
“A WiMAX Design Library for System-level RF/DSP Co-design,” No. 11, p. 36.

Applied Engineering Products (AEP)
“SMP Microminiature High Frequency Connectors,” No. 3, p. 32.

Baddeley, Adam
“Secure Personal Communications on the Battlefield,” No. 8, p. 30.

Cameron, Tom
“UHF RFID Industry Growth Powered by RF Technology,” No. 11, p. 32.

DCM Industries Inc.
“An RF/Microwave Test Solution for Cable Assembly and Aerospace Testing,” No. 3, p. 14.

Howe, Jr., Harlan
“2005 Connector, Cable and Cable Assembly Survey,” No. 3, p. 6.

Howe, Jr., Harlan, Richard Mumford and Michael Puttré
“Military Microwaves 2005 – Current Viewpoints on Technologies for Deployable Forces,” No. 8, p. 6.

Howe, Jr. Harlan, Richard Mumford and Bob Wallace
“Wireless Technologies – Viewpoints from Two Markets and Two Continents,” No. 11, p. 8.

M/A-COM Inc.
“New Lightweight Cable Assemblies for High Performance Airborne Applications,” No. 8, p. 54.

“A Combined Naval RESM, ELINT, CESM, COMINT and SIGINT System,” No. 8, p. 46.

Nash, Eamon
“Measuring VSWR and Gain in Wireless Systems,” No. 11, p. 22.

“Non-magnetic RF Coaxial Connectors,” No. 3, p. 22.

Radio Frequency Systems
“A Small 4 GHz Antenna Suitable for Military Applications,” No. 8, p. 50.

Times Microwave Systems
“SMA and QMA Two-piece Connectors for Use on Low Loss Coaxial Cable,” No. 3, p. 28.

UltraSource Inc.
“Innovative Thin Film Techniques to Eliminate Faulty Wire Bonds and Improve High Frequency Circuit Densities,” No. 8, p. 40.

W.L. Gore & Associates Inc.
“Flexible 110 GHz Test Cable Assemblies,” No. 3, p. 36.