Available in 99.5% purity levels, Tecdia Alumina Substrates excel in high-frequency applications. Custom patterned metallization thicknesses from 10nm to 8μm with lines as narrow as 10μm. Side metallization, thru holes, and via holes are also available.

Features:

• Excellent thermal conductivity, electrical insulation, and physical strength characteristics
• Plating available from 10nm to 8μm with resistive films also available
• High purity (99.5%) reduces loss in high-frequency applications

Uses:

• Input/output substrates for high-frequency devices
• Submounts and relay boards for optical communications devices
• Circuit boards for communication devices