Available in 99.5% purity levels, Tecdia Alumina Substrates excel in high-frequency applications. Custom patterned metallization thicknesses from 10nm to 8μm with lines as narrow as 10μm. Side metallization, thru holes, and via holes are also available.
Features:
- Excellent thermal conductivity, electrical insulation, and physical strength characteristics
- Plating available from 10nm to 8μm with resistive films also available
- High purity (99.5%) reduces loss in high-frequency applications
Uses:
- Input/output substrates for high-frequency devices
- Submounts and relay boards for optical communications devices
- Circuit boards for communication devices
