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Coming Soon - 100 Gbps Wireless

This week two separate news items, one from Tektronix/IEMN and the other from Nippon Telegraph and Telephone Corporation (NTT), both announced development of 100 Gbps “wireless fiber” solutions. Each took a different route with Tektronix and IEMN (a French research laboratory) demonstrating a single carrier wireless link with a 100 Gbps data rate signal at 252 to 325 GHz per the recently published IEEE 802.15.3d standard while NTT used a new principle, Orbital Angular Momentum (OAM) multiplexing at 28 GHz  with MIMO technology.


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Compare Materials in a Meaningful Way

Selecting a circuit board material for an application often comes down to a choice based on which has better specifications on the data sheet. Two different PCB materials from different suppliers might look identical in terms of key specifications, such as dielectric constant (Dk) and dissipation factor (Df), making a choice difficult. But how close are those two materials really? When can the data sheets look the same but the two materials be quite different?


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5G Ready to Launch - Brooklyn 5G Summit Summary

The Brooklyn 5G Summit celebrated its 5th meeting for 2018 at NYU WIRELESS. Leaders and technologists from leading operators such as AT&T, DoCoMo, KT, T-Mobile US, Verizon and Vodafone discussed the latest results and plans for future 5G networks. In addition, major infrastructure leaders like Nokia, Ericsson and Huawei, plus smaller companies such as Phazer, Blue Danube, BluWireless and InterDigital, were on hand showing off the latest results and technology. It was the most exciting 5G Summit to date by many accounts, as the rollout of 5G starts this year with the accelerated standards and deployment schedule from a few years ago.


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NSF Announces Important Milestone in its Platforms for Advanced Wireless Research Effort

The National Science Foundation (NSF), along with an industry consortium of 28 networking companies and associations that includes NI, announced the first two Platforms for Advanced Wireless Research (PAWR) initiative awards. The two platforms will be led by teams from the University of Utah, Rice University, NYU, and Rutgers University.


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Hybrid Multilayer PCBs Help Keep Vehicles Safe

Advanced automotive electronics systems have relied on the reflections from on-board vehicular radar systems for some time. The vehicular radars are often fabricated on what are known as hybrid multilayer PCBs. These are PCBs formed of different kinds of circuit-board materials, matching the characteristics of the different materials to the needs of the different circuit functions, from DC through 77 GHz. Learn about designing with these new layers to realize better performing circuits at a lower cost.


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Satellite 2018 Review - Snowed In!

I was suppose to fly down to DC on Tues  to spend a couple of days catching up on the newest trends and products at Satellite 2018. But the Nor'easter dumped 2 feet of snow on Boston and every flight I could find was cancelled. So I remotely monitored the happenings at the event and collected the following materials from press releases and emails about what was on display for RF/microwave products.


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Don’t underestimate 5G and IoT rollout

Lessons learned from MWC 2018

Mobile World Congress solidified that 5G is fast approaching with deployments this year. In the US, Verizon is rolling out 5G millimeter wave Fixed Wireless Access in many cities and AT&T is rolling out 5G mobile service. T-Mobile will not be far behind with their dual band 600 MHz and 28 GHz 5G rollout starting Q2 of next year.


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