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Materials/Packaging related products


New web site strengthens Remtec's position as leader in providing ceramic packaging solutions

 Remtec Inc., the leading manufacturer of substrates and packages using Plated Copper On Thick Film (PCTF®) metallization, has completed a new, comprehensive web site that strengthens Remtec's position as the leader in providing ceramic solutions for DC power electronics, optoelectronics and RF/MW applications. 

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T-Tech Inc. & The Geek Group partner to provide PCB design/prototyping

T-Tech Inc. and The Geek Group announced a joint agreement to offer a state of the art solution and facility for rapid printed circuit board (PCB) design, verification, and fabrication. The collaboration will combine T-Tech's QCJ5 series Quick Circuit System and IsoPro® Software for PCB prototyping with The Geek Group's expertise and 43,000 square foot Leonard Street Labs Facility in Grand Rapids, Michigan.

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Remtec develops new, cost-effective gold tin plating technique

Remtec Inc., the leading manufacturer of substrates and packages using plated copper on thick film (PCTF) metallization, has adapted its gold-tin plating technology on metallized ceramics to include a newly developed technique of selectively applying AuSn deposits for interconnecting RF and microwave electronic components, lead frames and other miniature parts on high frequency PC boards.

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CVD Diamond High Power Resistors and Terminations

Commonly used substrates for high power resistors and terminations are Beryllia, Aluminum Nitride, and to alesser extent, Boron Nitride and Silicon Carbide. While these materials are known for their superior thermal properties, none of them come even close to matching the thermal conductivity of CVD Diamond.

Bringing Rapid Prototyping In-House

Whenever time to market is critical, rapid prototyping can produce a first draft of a new product that allows testing, evaluation, and further refinement of the product idea, which helps a company more quickly and cost-effectively transform early concepts into marketable products. At the same time, for concepts that may not make practical products, rapid prototyping can spare a company further investment time and expenses by revealing the product's flaws at an early stage of the development process.

RF Substrate Technologies for Mobile Communications

This white paper discusses a variety of RF materials and substrates capable of meeting RF Front-End module designers’ requirements. You will gain insight into how state-of-the-art expertise in substrate technology can enable the mobile devices of the next decade.


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