April 4, 2012
As strange as it may sound, the use of circuit defects is a growing trend in high-frequency circuit design, especially for passive circuits such as filters. More precisely, the trend is in the increased use of defected ground structures (DGSs) and defected microstrip structures (DMSs) to alter the responses of microstrip circuit designs. Just what are these DGS and DMS forms, and does incorporating them into a high-frequency circuit change the way the PCB material should be specified?Read More
March 20, 2012
The transition, from a waveguide or coaxial connector to the PCB, is critical to the performance of the circuit, and the PCB’s thickness can impact how an end launch transition is made. Waveguide and coaxial connectors come in many shapes and sizes, as do PCB thicknesses, and matching the connector to the substrate thickness can play a large role in the overall performance and reliability of that design.Read More
March 12, 2012
The UK’s Nanotechnology Knowledge Transfer Network (NanoKTN) announced details of a product developed by Plessey Semiconductors, as part of a project co-funded by the Technology Strategy Board (TSB), with support from the NanoKTN and JEMI UK.
March 5, 2012
In order to better serve customer demand for high-end crystals, voltage controlled crystal oscillators (VCXO), temperature compensated crystal oscillators (TCXO), oven controlled crystal oscillators (OXCO) and crystal filters, MSC Vertriebs GmbH has signed a distribution agreement for Germany, Austria and Switzerland (the DACH region) with Precision Devices UK Ltd.
February 24, 2012
LPRS, Europe’s leading supplier of short-range radio devices announced the availability of the multi-channel telecommand transmitter and receiver modules. The new CDT-TX-02M-R and CDT-RX-02M-R modules offer long range control, low voltage operation with low current consumption for reliable battery operation and CDT-01-compatible communication format.
February 13, 2012
Infineon Technologies and Fairchild Semiconductor have extended their compatibility partnership to encompass Infineon’s proprietary 5 x 6 power stage asymmetric dual MOSFET package. The PowerStage 5 x 6 is a leadless SMD package, which integrates the low-side and high-side MOSFET of a synchronous DC/DC converter into a 5 by 6 mm² package outline.
February 8, 2012
As promised, we are off to the races, untangling the convoluted subject of PCB surface finishes. This is a complicated subject, so bear with me as I try to break it down into bite-sized, manageable portions! This week I will discuss each available surface finish and the pros and cons of each one.Read More
February 8, 2012
Multilayer printed-circuit boards (PCBs) have gained in popularity as designers seek to shrink their circuits. They offer the opportunity to stack a wide range of functions on one multilayer design, even combine analog, digital, and microwave circuits on a single circuit assembly. Designers have learned how to stack laminates with different relative dielectric constants, such as PTFE-based laminates and FR-4, in compact multilayer circuits, but creating such circuits requires careful planning and a good understanding of the role that bonding films and prepregs play in multilayer circuits.Read More
December 22, 2011
SemiGen Inc. , an RF/microwave assembly and automated PCB manufacturing house, has announced the opening of its new RF Supply Center and will begin accepting orders for epoxies, bonding tools, gold wire and other supplies used in the manufacture and test of microwave modules and components on January 3rd,...Read More
November 18, 2011
Remtec , a leader in ceramic packages based on Plated Copper on Thick Film (PCTF) technology, has developed an efficient, cost effective chip scale packaging approach for flip chip power devices. It allows for simple, effective packaging of various Si, SiC and GaN FET transistors -- MOSFETs and eGAN...Read More
DOCUMENTS AND FILES
December 15, 2012
Commonly used substrates for high power resistors and terminations are Beryllia, Aluminum Nitride, and to alesser extent, Boron Nitride and Silicon Carbide. While these materials are known for their superior thermal properties, none of them come even close to matching the thermal conductivity of CVD Diamond.
August 13, 2012
Whenever time to market is critical, rapid
prototyping can produce a first draft of a new product that allows testing, evaluation, and further refinement
of the product idea, which helps a company more quickly and cost-effectively transform early concepts into
marketable products. At the same time, for concepts that may not make practical products, rapid prototyping
can spare a company further investment time and expenses by revealing the product's flaws at an early stage
of the development process.
June 13, 2012
This white paper discusses a
variety of RF materials and
substrates capable of meeting
RF Front-End module
You will gain insight into how
state-of-the-art expertise in
substrate technology can
enable the mobile devices of
the next decade.