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Manufacturing and services related products


LPKF introduces seal of approval

July 28, 2014

Effective immediately, users of Laser Direct Structuring (LDS) technology will receive a seal of approval from the laser specialists LPKF.

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LPKF opens Korean service and sales subsidiary

March 24, 2014

On 1 April 2014 LPKF will open a service and sales subsidiary office in Seoul, Korea, which will be just in time to complement the company’s participation at the SMT/PCB & Nepcon Korea Trade Show that takes place in the city from 2 to 4 April.

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Cree selects Plextek RF Integration as preferred European design resource

March 6, 2014

Plextek RF Integrationhas been selected by Cree as a preferred design resource to provide third party design services to Cree’s European foundry customers.

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Isola expands manufacturing capabilities in Suzhou, China

July 22, 2013

Isola Group S.a.r.l., a market leader in laminate materials used to fabricate advanced multi-layer printed circuit boards, has expanded its Suzhou, China manufacturing facility.

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Huber + Suhner opens new production centre in China

June 17, 2013

Huber + Suhner opened its new state-of-the-art facility in Changzhou, East China, which will enable the company to manufacture products from all three core technologies – radio frequency, fiber optics and low frequency – in China.

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New Thales Research and Technology Canada centre inaugurated

November 19, 2012

Thales Canada announced that its R&D facility in Parc du Technologique is now an official Thales Research and Technology (TRT) centre – the fifth in the world and first in North America.

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e2v releases demonstration kit for 12 bit 1.5 GSps ADC, EV12AS200

MarketWatch: International
November 12, 2012

e2v has launched a demonstration kit for its 12 bit 1.5 GSps analogue to digital converter, which allows for faster ADC performance evaluation.

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Plextek expands V-Band and E-Band design services

July 23, 2012

In response to the growing requirement for high data rate wireless applications, Plextek Ltd. has extended its test and measurement facilities to 75 GHz capability. This includes increasing development activity at V-Band (50 to 75 GHz) and E-Band (60 to 90 GHz).

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Samsung and Cadence deliver 20 nm digital design methodology

June 11, 2012

Cadence Design Systems, Inc. and Samsung Electronics have collaborated to deliver a 20 nanometer design methodology that incorporates double patterning technology for joint customer deployment and internal test chips. The collaboration brings new process advances for mobile consumer electronics, enabling design at 20 nm and future process nodes.

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Sub10 Systems expands global operations in North America

April 2, 2012

Sub10 Systems has appointed SideBand Systems Inc. as its first North American distributor and value-added reseller. The company will resell all Sub10 Systems’ point-to-point radio link products in the U.S. market.

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Bringing Rapid Prototyping In-House

August 13, 2012
Whenever time to market is critical, rapid prototyping can produce a first draft of a new product that allows testing, evaluation, and further refinement of the product idea, which helps a company more quickly and cost-effectively transform early concepts into marketable products. At the same time, for concepts that may not make practical products, rapid prototyping can spare a company further investment time and expenses by revealing the product's flaws at an early stage of the development process.

The Advantages of Outsourcing Your RF/Microwave Assembly to an Onshore Contractor

April 6, 2012
Shifting landscapes suggest RF/Microwave companies keep manufacturing closer to home. The outsourcing decision for RF/Microwave (RF/MW) companies, however, has a unique set of circumstances when compared to conventional digital electronics.


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