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Semiconductors / Integrated Circuits

Semiconductors/MMIC/RFIC related products

ARTICLES

MEI Wet Bench Automates Wafer Fab

RFIC
May 15, 2013

MEI was at CS Man Tech the week of May 13th to demo the company's high-quality semiconductor and batch immersion process tools that perform. All MEI’s semiconductor equipment are custom tailored to specific semiconductor processes and chemistry.


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Cree to feature its GaN technology in RF Zone at CTIA 2013

May 8, 2013

Cree Inc. will be a first time exhibitor this year in the RF/Microwave Zone at CTIA 2013. The RF Zone, which is organized and managed by Microwave Journal, features approximately twenty RF component and communication IC manufacturers along with test equipment providers. Cree is a world’s leading manufacturer of GaN HEMT devices, which are ideally suited for a host of telecom applications in both macro-base stations and small cells. These devices are perfect for applications seeking to improve bandwidth, efficiency, frequency of operation, or for transmitters challenged to reduce size and weight.


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ST and ESA perform first position fix using Galileo satellites

International
April 22, 2013

STMicroelectronics announced that its Teseo II single-chip satellite-tracking ICs were successful in the first ground location test using Europe’s Galileo navigation system.


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Interlligent RF & MW Solutions to supply Lime with T&M equipment

April 5, 2013

Lime Microsystems has signed a deal with Interlligent RF & MW Solutions to use the company's latest test and measurement technology in the development of its FPRF transceiver ICs.


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Renesas Electronics announces R-Car H2 for automotive market

March 28, 2013

Renesas Electronics and Renesas Mobile Corp. have announced the availability of a new member of the R-Car Series of automotive Systems-on-Chip (SoCs).


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e2v aerospace and defense provides life extension program for Micron products

March 28, 2013

e2v aerospace and defense Inc.(e2v a&d announces a life extension program for selected Micron Technology Inc. memory devices.


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Renesas Electronics Europe expands sales in Russia and CIS

March 25, 2013

Renesas Electronics Europe, supplier of advanced semiconductor solutions, has launched an expanded drive to build sales in Russia and other CIS countries.


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Tensilica and Huawei expand strategic relationship

March 8, 2013

Tensilica® Inc. has strengthened its strategic relationship with Huawei with the announcement that HiSilicon, the semiconductor division of Huawei, is expanding its use of Tensilica’s Dataplane Processor Units.


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STMicroelectronics reaches three billion MEMS sensor milestone

February 4, 2013

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced it has shipped three billion MEMS sensors to date.


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STMicroelectronics receives IEEE Standards award for 2012

December 21, 2012

STMicroelectronics has been awarded the prestigious 2012 Corporate Award from the IEEE Standards Association) in recognition of its advancement of standards in electrical and electronics engineering.


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DOCUMENTS AND FILES

Pulsed GaN Power Transistors

April 17, 2013

This paper explains the pulsed RF operation of Microsemi pulsed GaN HEMT RF power transistors using as an example the 1011GN-700ELM 1030 MHz Mode-S Enhanced Message Length (ELM) avionics device. General descriptions are presented detailing both the pulsed gate bias operation and the bias sequencing operation of the pulser circuit used on the Microsemi evaluation test fixtures.

Pulsed RF Operation of Microsemi GaN RF Power Transistors

April 16, 2013

This paper explains the pulsed RF operation of Microsemi pulsed GaN HEMT RF power transistors using as an example the 1011GN-700ELM 1030 MHz Mode-S Enhanced Message Length (ELM) avionics device. General descriptions are presented detailing both the pulsed gate bias operation and the bias sequencing operation of the “pulser” circuit used on the Microsemi evaluation test fixtures.

Understanding VCO Concepts

January 16, 2013
This application note looks at VCO fundamentals, for typical oscillator designs through tuning sensitivity characteristics. Examples of a Colpitts and Clapp circuit are presented.

High Voltage Inverting Charge Pump Produces Low Noise

December 15, 2012

Dual-polarity supplies are commonly needed to operate electronics such as op amps, drivers, or sensors, but there is rarely a dual-polarity supply available at the point of load. The LTC®3260 is an inverting charge pump (inductorless) DC/DC converter with dual low noise LDO regulators that can produce positive and negative supplies from a single wide input (4.5V to 32V) power source. It can switch between high efficiency Burst Mode® operation and low noise constant frequency mode, making it attractive for both portable and noise-sensitive applications.

Biasing Constant Current MMICs

December 7, 2012

The Mini-Circuits family of microwave monolithic integrated circuit (MMIC) Darlington amplifiers offers the RF designer multi-stage performance in packages that look like a discrete transistor.

New GaN FETs, Amplifiers and Switches Offer System Engineers a Way to Reduce RF Board Space and System Prime Power

September 17, 2012
Ever-increasing demands for faster product launch times, higher performance, lower part counts and reduced costs create RF system design challenges. This paper focuses on how the latest gallium nitride (GaN) products, specifically discrete transistors, amplifiers and switches, offer design engineers enhanced flexibility and performance options by reducing RF board space and system prime power requirements.

Small-Signal Intermodulation Distortion in OFDM Transmission Systems

August 13, 2012
A system that utilizes OFDM/OFDMA, such as the E-UTRA (LTE) downlink or the IEEE 802.11a/g and the IEEE 802.16 physical layers, transmits OFDM symbols, each comprising a number of modulated sub-carriers carrying data or pilot symbols, with inter-subcarrier spacing being equal to or an integer multiple of a fixed frequency. The channel bandwidth (B) is determined by the number of 'occupied' (modulated) subcarriers and the subcarrier spacing.

Multicarrier TD-SCMA Feasibility

August 13, 2012
There are several options for the architecture of the transmit signal path. The factors that impact transmit signal elements are introduced, followed by a discussion of the different architectures. Figure 1 shows a direct conversion architecture for an initial point of reference only. Section 6 of 3GPP TS 25.105 describes the transmit signal requirements used throughout this discussion.

Harmonic Mixer Primer: The Gateway to the Millimeter Wave Frontier is Harmonic Mixer Technology

July 17, 2012
The next frequency frontier is the millimeter wave (mm-wave) band, which occupies the 30 GHz to 300 GHz spectrum (wavelengths from 10 to 1 mm). Emerging applications now span radio astronomy, communication, imaging, space research, and homeland security, and are starting to seriously populate this vast spectrum resourse. Market forecast and limited available spectrum suggest that attractive growth is just over the horizon so explorers are naturally migrating to stake their claim in this next frontier.

Small-Signal Intermodulation Distortion in OFDM Transmission Systems

June 13, 2012
The small-signal nonlinear distortion of a system can be described with sufficient accuracy using a third order Volterra expansion of the output in terms of the input. This simple model assumes a memoryless, frequency independent amplifier system, whereby the amplifier characteristics remain constant over the operation bandwidth or, stated equivalently, the operation bandwidth is small compared with the available amplifier system bandwidth....

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