Items Tagged with 'exhibition'

ARTICLES

EDI CON 2014 opening ceremonies to discuss electronics driving next generation telecommunications and security systems

The Electronic Design Innovation Conference (EDI CON), the industry-driven event for RF, microwave and high speed digital electronic designers to be held April 8-10 at the Beijing International Convention Center will present an opening plenary session emphasizing future communication and aerospace/defense systems made possible through advanced high-frequency ICs.


Read More

RFHIC joins EDI CON 2014 as a Gold sponsor

Leading GaN-based RF power amplifier manufacturer will share its expertise in wideband, high performance devices with Chinese designers and wireless infrastructure system integrators

Horizon House Publications and Microwave Journal China announced the participation of RFHIC, a global leader in the design and manufacture of RF & Microwave components, as a Gold sponsor of the 2014 Electronic Design Innovation Conference (EDI CON 2014) to be held April 8–10, 2014 at the Beijing International Convention Center in Beijing, China.


Read More

Coilcraft to participate in EuMW

Coilcraft Inc. will be participating in the 16th European Microwave Week, being held October 6-11 at the Nürnberg Convention Center, Nuremberg, Germany. The Coilcraft exhibit will include its broad range of wirewound component families, each providing best-in-class performance across market applications. The Exhibition portion of the event runs Tuesday, October 8th through Thursday, October 10th.


Read More

Laird Technologies to showcase EMI and microwave solutions at IMS 2013

When the IEEE International Microwave Symposium opens early next month, Laird Technologies Inc., a global technology company, will be there to showcase its best-in-class EMI and microwave materials to design engineers looking for solutions with proven results. Addressing EMI issues early in the design process is critical, and Laird’s customizable solutions are ideal for engineers working at VHF, UHF, microwave and millimeter wave frequencies in industries ranging from wireless and telecommunications to medical and military. 


Read More

Rogers shows advanced circuit material solutions and offers design guidance at IMS 2013

Rogers Corp. will highlight several of its high quality printed circuit board (PCB) materialsat the upcoming 2013 IEEE International Microwave Symposium (IMS).  Rogers’ Advanced Circuit Materials representatives will be on hand at exhibition booth #1459. In addition, John Coonrod, Rogers Market Development Engineer, will be presenting “Determining Circuit Material Dielectric Constant from Phase Measurements.” as part of the technical program.


Read More

LPKF to host PCB prototyping demo at MTT-S

Attendees of the 2013 International Microwave Symposium (IEEE MTT-S) Exhibition will have the opportunity to see printed circuit boards made live and in-person by visiting LPKF Laser & Electronics in booth 2215. The in-house rapid PCB prototyping specialist has announced that they will be demonstrating two PCB prototyping systems at the exhibition, which takes place at the Washington State Convention Center in Seattle, Wash., June 4-6.


Read More

Richardson RFPD at M2M Zone at CTIA Wireless 2013

Richardson RFPD Inc. announces its attendance and participation at the M2M Zone at CTIA Wireless 2013. Presented by CTIA – The Wireless Association®, CTIA is a large wireless communications conference and exhibition that includes service operators, retailers, distributors, application providers, and more. The M2M Zone Conference and Pavilion showcases those companies in the dynamic M2M (machine-to-machine) segment of wireless communications.


Read More

WIMA announces 7th NFC Applications, Hardware and Use Cases Congress in Monaco

WIMA, the leading global conference and exhibition dedicated to near field communication (NFC), announced the 7th WIMA NFC MONACO will be held from 10 - 12 April at the Grimaldi Forum in Monaco. NFC industry leaders, start-up companies, developers, solution and hardware providers will come together with end users and brands for networking and partnering to drive forward business and innovation within the NFC ecosystem.


Read More