Remtec Inc., the leading manufacturer of substrates and packages using plated copper on thick film (PCTF) metallization, has adapted its gold-tin plating technology on metallized ceramics to include a newly developed technique of selectively applying AuSn deposits for interconnecting RF and microwave electronic components, lead frames and other miniature parts on high frequency PC boards.
Horizon House Publications and Microwave Journal China announced the lineup of Gold-level sponsors for next year’s Electronic Design Innovation Conference (EDI CON 2014). The Gold sponsors are Anritsu, CST, SpirentCommunications, Mini-Circuits and Richardson RFPD.
Richardson RFPD Inc. announces availability and full design support capabilities for two new high-frequency vertical diffusion metal oxide semiconductor (VDMOS) MOSFETs from Microsemi Corp. (Microsemi).
AEM Inc. announces that it is a recipient of a 2012 Boeing Gold Performance Excellence Award. AEM maintained a Gold composite performance rating for quality and delivery for the twelve month period from October 1, 2011 to September 30, 2012. This year, Boeing recognized 594 suppliers who achieved either a Gold or Silver level Boeing Performance Excellence Award. AEM is one of only 153 suppliers to receive the Gold level of recognition achieving this status for four consecutive years.
SemiGen Inc. (www.semigen.net), an ISO and ITAR registered RF/Microwave assembly, automated PCB manufacturing, and RF Supply Center, has announced the recent addition of key components to their RF Supply Center’s stockroom. The RF Supply Center is now offering PIN and limiter diodes that meet the most common RF/Microwave design specifications.
Remtec Inc. has added a new universal finish of Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) as a standard finish to its umbrella of fabrication methods. The new finish resolves a problem of intermetalics detrimental to the reliability of solder joints (black pad formations) and wire bonding connections.
Ferro Electronic Materials expands its low temperature co-fired ceramic (LTCC) portfolio, which includes industry-leading A6M and A6S,with a new line of cost-effective matched materials that offers better performance over a greater range of frequenciesand easier manufacturability than market alternatives. The company will introduce its new L8LTCC product line in booth 9-212 at SMT Hybrid Packaging 2012, to be held May 8-10 in Nuremberg, Germany.