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Items Tagged with 'gold'

ARTICLES

Remtec develops new, cost-effective gold tin plating technique

Remtec
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Remtec Inc., the leading manufacturer of substrates and packages using plated copper on thick film (PCTF) metallization, has adapted its gold-tin plating technology on metallized ceramics to include a newly developed technique of selectively applying AuSn deposits for interconnecting RF and microwave electronic components, lead frames and other miniature parts on high frequency PC boards.


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Richardson RFPD announces addition to line of 50 V moisture-resistant DMOS transistors from ST

Richardson RFPD Inc.
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Richardson RFPD Inc. announces immediate availability and full design support capabilities for a new diffused metal oxide semiconductor (DMOS) transistor from STMicroelectronics (ST).


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EDI CON 2014 Gold sponsors offer solutions for next generation communication systems in China

Horizon House Publications and Microwave Journal China
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Horizon House Publications and Microwave Journal China announced the lineup of Gold-level sponsors for next year’s Electronic Design Innovation Conference (EDI CON 2014). The Gold sponsors are Anritsu, CST, Spirent Communications, Mini-Circuits and Richardson RFPD.


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Richardson RFPD introduces two RF power vertical MOSFETs from Microsemi

Richardson RFPD Inc.
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Richardson RFPD Inc. announces availability and full design support capabilities for two new high-frequency vertical diffusion metal oxide semiconductor (VDMOS) MOSFETs from Microsemi Corp. (Microsemi).


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AEM wins 2012 Boeing Gold Performance Excellence Award

AEM Inc.
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AEM Inc. announces that it is a recipient of a 2012 Boeing Gold Performance Excellence Award. AEM maintained a Gold composite performance rating for quality and delivery for the twelve month period from October 1, 2011 to September 30, 2012. This year, Boeing recognized 594 suppliers who achieved either a Gold or Silver level Boeing Performance Excellence Award. AEM is one of only 153 suppliers to receive the Gold level of recognition achieving this status for four consecutive years.


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Diodes added to SemiGen's RF Supply Center

SemiGen Inc.
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SemiGen Inc. (www.semigen.net), an ISO and ITAR registered RF/Microwave assembly, automated PCB manufacturing, and RF Supply Center, has announced the recent addition of key components to their RF Supply Center’s stockroom. The RF Supply Center is now offering PIN and limiter diodes that meet the most common RF/Microwave design specifications.


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Remtec adds new ENEPIG universal finish

Remtec Inc.
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Remtec Inc. has added a new universal finish of Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) as a standard finish to its umbrella of fabrication methods. The new finish resolves a problem of intermetalics detrimental to the reliability of solder joints (black pad formations) and wire bonding connections.


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LTCC materials system from Ferro Electronic Materials helps reduce power use

Ferro Electronic Materials
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Ferro Electronic Materials expands its low temperature co-fired ceramic (LTCC) portfolio, which includes industry-leading A6M and A6S,with a new line of cost-effective matched materials that offers better performance over a greater range of frequenciesand easier manufacturability than market alternatives. The company will introduce its new L8LTCC product line in booth 9-212 at SMT Hybrid Packaging 2012, to be held May 8-10 in Nuremberg, Germany.


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