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Items Tagged with 'silver'

ARTICLES

P1dB Inc. announces a full line of low PIM adapters

January 31, 2014

P1dB Inc., a leading manufacturer of RF and microwave coaxial connectors, cable assemblies, adapters and terminations, is introducing a full line of low-PIM adapters within their P1LP-ADP line. Available for 7/16 and Type N within-series applications and 7/16 between-series (Type N and SMA) applications, the new high-performance line of adapters complements P1dB’s high quality low-PIM cable assemblies.


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Indium Corp. features new, high-reliability solder alloy SACM at Productronica

October 30, 2013

Indium Corp. will feature its new technology platform using the SACM™ Solder Alloy at Productronica November 12-15 in Münich, Germany. 


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Richardson RFPD receives Silver Boeing Performance Excellence Award

March 18, 2013

Richardson RFPD Inc. announced that it has received a 2012 Boeing Performance Excellence Award. The Boeing Co. issues the award annually to recognize suppliers who have achieved superior performance. Richardson RFPD maintained a Silver composite performance rating for each month of the 12-month performance period.


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DuPont MCM introduces new low cost conductive inks for printed electronics

November 30, 2012

DuPont Microcircuit Materials (MCM) is introducing a new series of screen printed conductive ink materials for the printed electronics market, designed to offset the rising cost of silver. Utilizing proprietary technology and under typical processing conditions used for many printed electronic applications, DuPont PE8XX series conductive inks can provide low resistivity with 20 percent or more potential cost savings for manufacturers.


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LTCC materials system from Ferro Electronic Materials helps reduce power use

April 3, 2012

Ferro Electronic Materials expands its low temperature co-fired ceramic (LTCC) portfolio, which includes industry-leading A6M and A6S,with a new line of cost-effective matched materials that offers better performance over a greater range of frequenciesand easier manufacturability than market alternatives. The company will introduce its new L8LTCC product line in booth 9-212 at SMT Hybrid Packaging 2012, to be held May 8-10 in Nuremberg, Germany.


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