Ted Rappaport, founding director of NYU WIRELESS and a leading proponent of using the millimeter wave spectrum for wireless communications, discusses the FCC's recent rulemaking actions and technology developments that are paving the way to 5G.
Ardent Concept's patented QUICKLINK™Connector mounts directly to the PCB with a twist-to-lock footprint design that requires only two small thru holes and a gold pad for the connector to land on. QUICKLINK™ footprints can be placed anywhere on your board to allow easy access to any channels from your device without having to solder on costly SMA or SMP surface mount receptacles.
Modelithics Inc., the industry leader in simulation models for RF, microwave, and millimeter wave devices, announces the availability of new Microwave Global Models™ for Passive Plus 0505C and 1111C surface mount chip capacitor families.
M/A-COM Technology Solutions Inc. (“MACOM”), announced a new portfolio of surface mount S-Band GaN power products optimized for commercial air traffic control, weather radar and military radar applications. The new products are available in a range of packaging options and power levels.
AEM Inc. announces a hirel-qualified Sn/Pb (tin/lead) conversion process designed to mitigate the formation of tin whiskers in surface-mount components. The AEM process eliminates potential damage to sensitive electronic devices caused by conventional hot-solder dippingwhile ensuring that converted component terminations contain a minimum of 5 percent Pb as verified by SEM/EDS and XRF inspection methods.