Items Tagged with 'telecom'

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Anite, a global leader in wireless device testing technology, announced that it has signed a further three-year agreement with Deutsche Telekom to provide interoperability test solutions. Deutsche Telekom owns the T-Mobile brand, one of the world’s top ten providers of mobile phone services.

Microlab, a Wireless Telecom Group company,is introducing a new product line for both in-Building and outdoor DAS applications, the DCC Series™ DAS Carrier Conditioners.  These products are equally suited for passive DAS venues and for active fiber DAS installations.

Radio Frequency Systems (RFS), the global wireless and broadcast infrastructure specialist, announced that it has introduced a new addition to the CompactLine® series of microwave antennas with the release of the 6 GHz Category A SB6-W60B. Featuring a wind-tunnel tested design suited for both tight urban locations and rugged outposts, the SB6-W60B offers a superior radiation pattern for consistent performance with less interference.  

Radio Frequency Systems (RFS), the global wireless and broadcast infrastructure specialist, announced that it has introduced a new addition to the CompactLine®  series of microwave antennas with the release of the 6 GHz Category A SB6-W60B. Featuring a wind-tunnel tested design suited for both tight urban locations and rugged outposts, the SB6-W60B offers a superior radiation pattern for consistent performance with less interference.  

The NGMN Board welcomes the launch of the LTE Patent Pool managed by VIA Licensing and combining the patent portfolios of 10 companies.

Molex Inc. and Radiall announced the continued collaboration and expansion of their cost-effective SMP-MAX series with new symmetrical adapters and RF coaxial interconnect solutions.

Infineon Technologies and Fairchild Semiconductor have extended their compatibility partnership to encompass Infineon’s proprietary 5 x 6 power stage asymmetric dual MOSFET package. The PowerStage 5 x 6 is a leadless SMD package, which integrates the low-side and high-side MOSFET of a synchronous DC/DC converter into a 5 by 6 mm² package outline.