- Buyers Guide
IQE plc announces the launch of gallium nitride based, high electron mobility transistor (GaN HEMT) epitaxial wafers on 150mm diameter semi-insulating silicon carbide (SiC) substrates supplied by the WBG Materials subsidiary of II‐VI Inc. (NASDAQ: IIVI), a global provider of engineering materials and optoelectronic components.
Rogers Corp., represented by its Power Electronics Solutions (PES) Division, will showcase some of its most advanced products for power electronic applications at the upcoming APEC 2013 conference and exhibition.
STMicroelectronics, Soitec (Euronext) and Circuits Multi Projets®(CMP) announced that ST’s CMOS 28 nm Fully Depleted Silicon-On-Insulator (FD-SOI) process, which uses innovative silicon substrates from Soitec, is now available for prototyping to universities, research labs and design companies through the silicon brokerage services provided by CMP.
Remtec®, the leading manufacturer of substrates and packages with Plated Copper On Thick Film (PCTF®), has significantly expanded its activity in the design and fabrication of DBC ceramic products for military and commercial applications in small to medium production volumes with fast prototyping and economic pricing.
Laser Services Inc. has announced the addition of a new microscope-aligned CO2 laser to bring greater capacity to their substrate and PCB cutting department. This brings the total of microscope-aligned CO2 lasers to four in daily operation, adding 33 percent capacity to their fine alignment capability. This increased capacity allows for quicker order turns and shorter lead times.
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