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EDI CON USA Announces 2017 Event: Save the Date!

Bringing together engineers working in RF/microwave with those working in high-speed digital, EDI CON USA offers an opportunity to learn from other disciplines and transfer techniques and methods between applications. The exhibit floor will include booths from industry-leading companies working in both of these areas, as well as feature the SI ZONE, a specialized demo area for signal integrity, power integrity and EMI/EMC products. 


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Ardent aims to eliminate surface-mount connectors with new QUICKLINK coaxial connector

Ardent Concept's patented QUICKLINK™Connector mounts directly to the PCB with a twist-to-lock footprint design that requires only two small thru holes and a gold pad for the connector to land on. QUICKLINK™ footprints can be placed anywhere on your board to allow easy access to any channels from your device without having to solder on costly SMA or SMP surface mount receptacles.


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James Komiak from BAE Systems to Keynote Amplifier Track at EDI CON USA

EDI CON USA 2016 is pleased to announce that James Komiak, Ph.D., renowned amplifier expert and Global Engineering/Scientific Fellow at BAE Systems, will be kicking off the conference’s amplifier track on Tuesday September 20 at 9:30 a.m. with a keynote talk. Taking place September 20-22 in Boston, Mass. at the Hynes Convention Center, the EDI CON USA conference and exhibition brings together engineers working on high-frequency analog and high-speed digital designs for learning and networking opportunities.  


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EDI CON USA announces Test & Measurement Content

EDI CON USA 2016, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place September 20-22 in Boston, Mass. at the Hynes Convention Center, announces its Measurement Track for this year’s conference and exhibition. The exhibition will host more than 138 exhibiting companies from the RF, microwave, and high-speed digital industries, including demonstration pods in the Signal Integrity Zone.


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EDI CON China 2016 achieves record attendance

EDI CON China 2016 took place April 19-21 in Beijing at the China National Convention Center (CNCC). Continuing on a strong trajectory of growth, EDI CON China achieved a 35 percent increase in attendees and 32 percent increase in exhibition space over 2015. This year’s conference included partnerships with the China Radar Industry Association Conference and EMC China Conference/Exhibition.


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