ANADIGICS Inc., a world leader in radio frequency (RF) solutions, announced that the company is shipping production volumes of its AWL9280 and AWL9580S Wi-Fi front end ICs (FEICs) to LG Electronics in support of the global launch of the LG G3 Beat.
Anite has announced that it is the first to launch an 802.11ac (WiFi) capable standalone channel emulation solution with continuous 160 MHz bandwidth support. This new capability will allow chipset manufacturers to accelerate development of new 802.11ac Phase two WiFi products.
Skyworks Solutions Inc., an innovator of high performance analog semiconductors enabling a broad range of end markets, announced that its industry leading wireless connectivity front-end modules (FEMs) are being leveraged by Broadcom Corp. for use in several of the company’s 5G WiFi solutions, enabling some of the fastest download speeds available in access points, routers, DSL/cable gateways, PCs, smartphones and tablets.
Avago Technologies, a leading supplier of analog interface components for wireless, wireline, and industrial applications, announced two new RF power amplifiers (PAs), the MGA-43728 and MGA-43828, and a new WiFi FBAR filter, the ACFF-1024, designed specifically for small cell base transceiver station (BTS) applications.
Skyworks Solutions Inc. expanded its wireless portfolio with the introduction of highly integrated front-end modules enabling 802.11ac connectivity in smartphones and tablets. The company’s precision analog semiconductors are already being utilized in many of the world’s first commercially-available 802.11ac notebooks, ultrabooks, LED TVs, routers, USB data cards and Blu-Ray® players.
Microsemi Corp., a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, delivered the world's first monolithic silicon germanium (SiGe) RF front-end (FE) device for the 5th generation of Wi-Fi devices based on IEEE 802.11ac standard. Benefitting from its industry-leading integration levels and utilizing high-performance SiGe process technology, the new LX5586 RF FE provides significant performance and cost advantages over existing technologies.
RF Micro Devices Inc., a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, reported financial results for the Company's fiscal 2013 first quarter, ended June 30, 2012.
RF Micro Devices Inc. announced the release of four high-performance front end modules (FEMs) for next generation WiFi applications. The RFMD® RFFM8200, RFFM8500, RFFM8202, and RFFM8502 are highly integrated FEM solutions covering multiple WiFi standards and frequency bands, particularly IEEE802.11n and the emerging 802.11ac specification. RFMD’s FEMs achieve industry-leading linear power and dynamic error vector magnitude (EVM) performance in support of the newest reference designs from the world’s leading WiFi chipset providers.