Items Tagged with 'electronics'

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Renesas Electronics Europe, supplier of advanced semiconductor solutions, has launched an expanded drive to build sales in Russia and other CIS countries.

Gowanda Electronics, a designer and manufacturer of precision electronic components for RF and power applications, was awarded Platinum Premier Supplier status at Rockwell Collins’ 2013 Annual Supplier Conference, held on March 6, 2013 in Cedar Rapids, Iowa.

Rogers Corp., represented by its Power Electronics Solutions (PES) Division, will showcase some of its most advanced products for power electronic applications at the upcoming APEC 2013 conference and exhibition.

LPKF Laser & Electronics has announced it will exhibit at the 2013 Electronics New England Exposition, which takes place April 10-11 at the Boston Convention and Exhibition Center in Boston, MA. From booth 1019, LPKF will highlight its line of in-house rapid PCB prototyping equipment by creating boards with its best-selling PCB milling machine, the ProtoMat S63.

Pulse Electronics Corp., a provider of electronic components, introduces a near field communications (NFC) antenna that is 40 percent thinner than similar NFC ferrite sheet antennas, while still complying with the EMVCo specification. The new ferrite sheet antenna enables mobile devices to read data from a distance of up to 40mm to enable them to communicate with other wireless devices for payments, access and control, credential storage and exchange, and content consumption.

Pulse Electronics Corp., a leading provider of electronic components, introduces RF MoCA (Multimedia over Cable Alliance) filter modules that are pin-in-paste compatible. Pin-in-paste manufacturing uses a reflow instead of a wave soldering process to apply solder to the components, saving time, increasing throughput, and reducing costs. These filters are compliant with MoCA 1.1 and 2.0 requirements and are qualified with leading MoCA silicon vendors.

Laird Technologies Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, announced it has expanded its EMI Metals product line with SMD Grounding Contacts. The EMI product line is a core piece of Laird’s value proposition to deliver solutions for today’s smaller, more advanced electronics. As part of Laird Performance Materials (LPM), these products provide vital protection for a wide range of high-performance electronic devices. 

RFMD returns to 2013 International CES with its industry-leading product portfolio and, as members of the ZigBee® Alliance, the company will be exhibiting in the ZigBee® Pavilion, Booth 20618 South Hall 1.

STMicroelectronics has been awarded the prestigious 2012 Corporate Award from the IEEE Standards Association) in recognition of its advancement of standards in electrical and electronics engineering.

Pulse Electronics Corp., a leading provider of electronic components, introduces a new line of Shadow low profile transit (SLPT) NMO and direct mount antennas to support public safety, WLAN, smart grid/smart metering, 3G, and 4G applications including long term evolution (LTE). These high-performance, rugged, IP-67 rated antennas are provided in a slim, low profile radome of only 2.5" to 3" (63.5 to 76.2 mm) tall with a 1.5" (38.1 mm) diameter base and high gains of 4 to 5.6 dBi.