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Items Tagged with 'conductivity'

ARTICLES

EMC Technology introduces CVD diamond heat spreaders

June 11, 2013

Following the success of the Diamond RF Resistives® product range, EMC Technology now offers CVD Diamond Heat Spreaders designed to meet today’s demanding requirements for higher power and longer life spans by keeping junction temperatures low and stable. CVD Diamond provides up to 8x the thermal conductivity of traditional materials like AlN and BeO.


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NMIC ships 10,000th aluminum diamond heat spreader for GaN devices

February 6, 2013

Nano Materials International Corp. (NMIC) announced that it has shipped its 10,000th aluminum diamond metal matrix composite (MMC) heat spreader for use in gallium nitride (GaN) RF power transistors and MMICs.


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Laird Technologies releases two new Tflex™ Series products

December 6, 2012

Laird Technologies Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, announced the release of two new Tflex™ series thermal gap fillers.  


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Rogers to showcase high performance printed circuit board materials at EuMW 2012

October 19, 2012

Rogers Corp. will be exhibiting at the 2012 European Microwave Week on October 29 through the 31st, at the Amsterdam RAI Exhibition and Convention Centre (Amsterdam, The Netherlands). European Microwave Week (www.eumweek.com) consists of three major conferences — the European Microwave Conference (EuMC), the European Microwave Integrated Circuits Conference (EuMIC), and the European Radar Conference (EuRAD), as well as a three day exhibition from October 29-31, 2012.


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