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Items Tagged with 'NXP'


NXP launches new RoadLINK solution

June 16, 2014

NXP Semiconductors announced that the TEF510x, the second product from the RoadLINK™ range, is now available to automotive OEMs and Tier 1 suppliers for design-in.

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NXP strengthens China team

March 24, 2014

NXP Semiconductors has appointed Li Zheng as Senior Vice President Sales & Marketing, Greater China and Country Manager for China, who will be based in Shanghai.

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NXP and Datang Telecom establish Chinese automotive semiconductor company

December 9, 2013

NXP Semiconductors and Datang Telecom Technology Co. Ltd. have established a joint venture that is claimed to be the first true automotive semiconductor company in China.

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NXP introduces first 3 A transistors in 1.1 mm² leadless plastic package

November 4, 2013

NXP Semiconductors has introduced the first transistors in a 1.1 mm by 1 mm by 0.37 mm low-profile discrete flat no-leads (DFN) package that boost current capabilities up to 3.2 A.

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NXP delivers first RoadLINK automotive processor

October 15, 2013

NXP Semiconductors N.V. announced that the first product from the RoadLINK™ range, the SAF5100 flexible software-defined radio processor for C2C and C2I communication, is available for automotive customer design-in.

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NXP transforms TD-LTE networks with Gen8+ LDMOS RF power transistors

May 28, 2013

NXP Semiconductors has launched its new Gen8+ LDMOS RF power transistors – an expansion of its eighth-generation LDMOS product line for wireless base stations with a strong focus on TD-LTE.

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NXP launches first dual-modem AISG transceiver for wireless base stations

March 18, 2013

NXP Semiconductors has introduced a groundbreaking family of programmable AISG transceivers for wireless base stations and antenna line devices such as tower-mounted amplifiers and remote electric tilt antennas.

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Audi and NXP announce strategic partnership for automotive innovation

November 19, 2012

NXP Semiconductors and Audi have signed a strategic partnership for innovation that focuses on innovation speed and time to market in eight selected automotive electronics application segments.

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Yeldi selects Identive and NXP for NFC cashless payment solution in India

October 15, 2012

Identive Group Inc. and NXP Semiconductors N.V. are providing innovative near field communication (NFC) payment tags to Yeldi Softcom Pvt Ltd to support the launch of its ‘ara eTap’ cashless payment application in India.

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