Items Tagged with 'NXP'

Rohde & Schwarz verifies NXP’s next-generation automotive radar sensor reference design for extremely short object distances.

Richardson RFPD, Inc. announced the availability and full design support capabilities for a new reference design from NXP Semiconductors, the A3G26D055N-100.

Cubtek Inc. is using network analyzers from Rohde & Schwarz in the development of 4D imaging radar for RF measurement of the E-Band. 

NXP’s i.MX RT1180 crossover MCU enables multi-protocol industrial IoT communications to support both real-time Ethernet and Industry 4.0 systems. 

NXP® Semiconductors announced a new series of RF power discrete solutions for 32T32R active antenna systems, complementing NXP’s existing portfolio of discrete GaN power amplifier solutions for 64T64R radios. 

NXP® Semiconductors announced that NXP’s Layerscape® and Layerscape Access family of processors have been chosen by Compal Electronics to power its new 5G integrated small cell solution. 

Richardson RFPD, Inc announced the availability and full design support capabilities for several new RF power multi-chip modules and the RapidRF demonstration platform from NXP Semiconductors.

NXP’s new single-chip NFC solutions provide security, dual-mode tamper status detection and battery-free sensing for IoT applications.

Anokiwave, NXP, YTTEK and Semicomm together demonstrated a complete 5G RU from baseband to mmWave using the O-RAN open architecture at a joint seminar recently held in Taiwan.

NXP® Semiconductors has announced that its WLAN8101H and WLAN8201C front-end modules (FEMs) enable Wi-Fi 6 connectivity in the Samsung Flip 3.