Audi AG has concluded an extensive field test of NXP Semiconductors and Cohda Wireless vehicle-to-vehicle (V2V) communications technology in Ingolstadt, Germany.
NXP Semiconductors announced a follow-on investment in Cohda Wireless, thus reinforcing the company’s commitment to drive the rapid global adoption of V2X technology.
Company representatives from NXP Semiconductors visited Rudong, Jiangsu province, China to exchange ideas on strengthening the development of smart manufacturing in Rudong.
NXP Semiconductors has entered into a definitive agreement with Quintic to acquire assets and IP related to its Wearable and Bluetooth Low Energy (BTLE) IC business.
NXP Semiconductors announced that the TEF510x, the second product from the RoadLINK™ range, is now available to automotive OEMs and Tier 1 suppliers for design-in.
NXP Semiconductors has appointed Li Zheng as Senior Vice President Sales & Marketing, Greater China and Country Manager for China, who will be based in Shanghai.
NXP Semiconductors and Datang Telecom Technology Co. Ltd. have established a joint venture that is claimed to be the first true automotive semiconductor company in China.
NXP Semiconductors has introduced the first transistors in a 1.1 mm by 1 mm by 0.37 mm low-profile discrete flat no-leads (DFN) package that boost current capabilities up to 3.2 A.
NXP Semiconductors N.V. announced that the first product from the RoadLINK™ range, the SAF5100 flexible software-defined radio processor for C2C and C2I communication, is available for automotive customer design-in.
NXP Semiconductors has launched its new Gen8+ LDMOS RF power transistors – an expansion of its eighth-generation LDMOS product line for wireless base stations with a strong focus on TD-LTE.
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